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S355N0R5K252CG 参数 Datasheet PDF下载

S355N0R5K252CG图片预览
型号: S355N0R5K252CG
PDF下载: 下载PDF文件 查看货源
内容描述: [High reliability and stability]
分类和应用:
文件页数/大小: 11 页 / 1787 K
品牌: WALSIN [ Walsin Technology ]
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Multilayer Ceramic Capacitors  
Approval Sheet  
APPLICATION NOTES  
Storage  
To prevent the damage of solderability of terminations, the following storage conditions are recommended:  
Indoors under 5 ~ 40°C and 20% ~ 70% RH.  
No harmful gases containing sulfuric acid, ammonia, hydrogen sulfide or chlorine.  
Packaging should not be opened until the capacitors are required for use. If opened, the pack should be  
re-sealed as soon as is practicable. Taped product should be stored out of direct sunlight, which might  
promote deterioration in tape or adhesion performance. The product is recommended to be used within 12  
months after shipment and checked the solderability before use.  
Handling  
Chip capacitors are dense, hard, brittle, and abrasive materials. They are liable to suffer mechanical  
damage, in the form of cracks or chips. Chip Capacitors should be handled with care to avoid contamination  
or damage. To use vacuum or plastic tweezers to pick up or plastic tweezers is recommended for manual  
placement. Tape and reeled packages are suitable for automatic pick and placement machine.  
Preheat  
In order to minimize the risk of thermal shock during soldering, a carefully controlled preheat is required.  
The rate of preheat should not exceed 3°C per secon d.  
Soldering  
Use middy activated rosin RA and RMA fluxes do not use activated flux. The amount of solder in each  
solder joint should be controlled to prevent the damage of chip capacitors caused by the stress between  
solder, chips, and substrate.  
a.) Hand soldering :  
Fig. 4.1 Hand Soldering Profile  
Chip Size  
1206  
Pre-Heat temp.  
150°C  
T  
Max. soldering iron temp.  
150°C  
130°C  
350°C  
280°C  
1210~2225  
150°C  
* Soldering iron tip diameter 1.0 mm and wattage max. 20W.  
* The Capacitors shall be pre-heated and that the temperature gradient between the devices and the tip of the  
soldering iron.  
* The required amount of solder shall be melted on the soldering tip.  
* The tip of iron should not contact the ceramic body directly.  
* The Capacitors shall be cooled gradually at room temperature after soldering.  
* Forced air cooling is not allowed.  
Page 10 of 11  
ASC Safety Certified X2_(S3)_011Y_AS  
May. 2019  
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