VSC838-01
Datasheet
Thermal Considerations
Thermal specifications for this device are based on the JEDEC standard EIA/JESD51-2 and have been modeled using
a four-layer test board with two signal layers, a power plane, and a ground plane (2s2p PCB). For more information,
see the JEDEC standard.
Table 13. Thermal Resistances
θ
0
JA (°C/W) vs. Airflow (ft/min)
Part Number
θJC
100
200
8.6
VSC838UG-01
0.15
11
10.1
To achieve results similar to the modeled thermal resistance measurements, the guidelines for board design described
in the JEDEC standard EIA/JESD51 series must be applied. For information about specific applications, see the
following:
EIA/JESD51-5, Extension of Thermal Test Board Standards for Packages with Direct Thermal Attachment
Mechanisms
EIA/JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
EIA/JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
EIA/JESD51-10, Test Boards for Through-Hole Perimeter Leaded Package Thermal Measurements
EIA/JESD51-11, Test Boards for Through-Hole Area Array Leaded Package Thermal Measurements
Moisture Sensitivity
This device is rated moisture sensitivity level 3 or better as specified in the joint IPC and JEDEC standard
IPC/JEDEC J-STD-020. For more information, see the IPC and JEDEC standard.
Ordering Information
VSC838-01
3.2 Gbps 36 x 36 Crosspoint Switch
Part Number
Description
VSC838UG-01
480-pin, plastic tape ball grid array (TBGA) with a 37.5 mm x 37.5 mm body size and
1.27 mm pitch. Device has higher supply current maximum and device total power rating
than VSC838.
18 of 19
VMDS-10195 Revision 4.0
August 19, 2005
VITESSE [ VITESSE SEMICONDUCTOR CORPORATION ]
