VSC838-01
Datasheet
Package Information
Top View
Bottom View
0.10
A
D
28 26 24 22 20 18 16 14 12 10
29 27 25 23 21 19 17 15 13 11
8
6
4
2
B
9
7
5
3
1
9
A
C
B
D
A1 ball
corner
E
F
G
H
10
J
K
L
M
P
N
E1
E
R
T
U
V
W
AA
AC
AE
AG
AJ
Y
AB
AD
AF
AH
D1
45 degree, 0.5 mm
chamfer (4 places)
Detail B
Detail A
Detail B
Side View
g
e
g
c
A
A1
e
Detail A
5
b
ccc C
C
∅
∅
0.30
0.10
M
M
C A
C
M B M
7
f
P
Seating plane
aaa C
6
Notes
Dimensions and Tolerances
1.ꢀ All dimensions and tolerances in millimeters.
2.ꢀ Dimension e is the basic solder ball grid pitch.
3.ꢀ Dimension M is the basic solder ball matrix size.
Reference Minimum Nominal Maximum
A
A1
D
D1
E
E1
b
c
1.8
0.65
37.5
35.56
37.5
35.56
0.75
1.15
0.35
29
1.95
0.70
37.7
1.65
0.60
37.3
4.ꢀ Dimension N is the maximum allowable number of balls after
depopulating.
37.3
37.7
5.ꢀ Dimension b is measured at the maximum solder ball
diameter parallel to the primary datum
6.ꢀ Dimension aaa is measured parallel to the primary datum
7.ꢀ Primary datum and the seating plane are defined by the
C .
0.65
1.05
0.3
0.85
1.25
0.40
C
.
C
f
M
spherical crowns of the solder balls.
8.ꢀ Substrate material base is copper.
9.ꢀ The bilaterial tolerance zone is applied to each side of the
package body.
480
N
aaa
ccc
e
0.15
0.15
1.27
typical
10.ꢀPin
1 can be identified by the 45 degree 0.5 mm chamfer
corner with the white dot.
P
g
0.15
0.40
Figure 7. Package Drawing
17 of 19
VMDS-10195 Revision 4.0
August 19, 2005
VITESSE [ VITESSE SEMICONDUCTOR CORPORATION ]
