VSC8113
Data Sheet
Thermal Considerations
The VSC8113 is packaged in a thermally-enhanced 100-pin PQFP with an embedded heat sink. The heat sink surface
configurations are shown in the package drawings. The air flow versus thermal resistance relationship is shown in
Table 20.
Table 20. Thermal Resistance
Value
Symbol
Parameter
(°C/W)
θ
θ
θ
θ
θ
θ
Thermal resistance from junction-to-case
1.2
JC
Thermal resistance from case-to-ambient with no airflow, including conduction through the leads.
Thermal resistance from case-to-ambient with 100 LFPM airflow
Thermal resistance from case-to-ambient with 200 LFPM airflow
Thermal resistance from case-to-ambient with 400 LFPM airflow
Thermal resistance from case-to-ambient with 600 LFPM airflow
27.5
23.1
19.8
17.6
16
CA
CA100
CA200
CA400
CA600
NOTE:
T
= max case temperature - (max power dissipation • θ
).
CAAIRFLOW
A(MAX)
21 of 22
G52154, Rev 4.5
6/28/02
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VITESSE [ VITESSE SEMICONDUCTOR CORPORATION ]
