VSC8113
Data Sheet
TOP VIEW
D
D1
PIN 100
Key
A
mm
3.40
0.25
2.7
Tolerance
MAX
MIN.
±.10
PIN 1
(NOTE 2)
RAD 2.92 ± .50
(2X)
A1
A2
D
17.20
14.00
23.20
20.00
0.80
0.65
0.30
0°-7°
.30
±.40
EXPOSED
HEATSINK
(NOTE 2)
D1
E
±.10
±.40
E1
L
±.10
±.2
e
NOM
±.10
9.0 X 9.0
(N0TE 2)
b
q
R
+0/-.1
NOM
R1
q2
q3
.2
(NOTE 2)
2.54±.50
15°
PIN 30
(2X)
15°
PIN 50
A2
e
R
NOTES:
θ
θ
(1) Drawings not to scale.
R1
2
(2) Two styles of exposed heat spreaders
may be used; square or oval.
(3) All units in millimeters unless otherwise noted
6° ± 4°
A1
0.25
A
θ
0.17 MAX
3
L
b
Figure 14. Package Drawing for 100-Pin PQFP (QB)
The VSC8113 is manufactured in a 100-pin PQFP package which will have one of two styles of exposed heat
spreaders; square or oval. The critical dimensions in the drawing represent the superset of dimensions for both
packages. The significant difference between the two packages is in the shape and size of the heatspreader
which needs to be considered when attaching a heatsink.
20 of 22
G52154, Rev 4.5
6/28/02
Confidential
VITESSE [ VITESSE SEMICONDUCTOR CORPORATION ]
