VITESSE
SEMICONDUCTOR CORPORATION
Datasheet
2.488 Gb/s ATM/SDH/SONET STM-16/STS-48
Mux/Demux and Section Terminator IC Chipset
VSC8025/VSC8026
IR Reflow Profile for Assembly of ASAT 192 TBGA
Figure 23: IR Reflow Profile for Assembly of ASAT 192 TBGA
C°
2
220°
200°
1
3
150°
25°
4
Time
Notes: 1) Peak temperature = 220°C
2) Peak time = 70 - 80 seconds
3) Time over 200°C = 110 - 120 seconds
4) Preheat time = ≥ 40 seconds (TYP)
All slopes are 1°C/sec for ramp up and ramp down
Industry standard eutectic solder balls: 62% tin, 36% lead, 2% silver
G52182-0, Rev. 4.0
1/5/00
VITESSE SEMICONDUCTOR CORPORATION
741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896
Page 41
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