VSC7123
Datasheet
Figure 11. Package Drawing for the VSC7123RD and VSC7123XRD
Top View
Bottom View
4
5
7
D
D1
D/2
D1/2
D
3
13
Exposed Pad
D2/2
E1/2
A
3
E1
7
5
E
4
B
3
e
D2
12
E/2
N/4 TIPS
0.20
4X
C
A-B
D
4X
0.20
H A-B D
E2/2
12
E2
Side View
11/13°
A
H
C
2
0.05
/ /
0.10
ccc
C
Dimensions and Tolerances
See Detail A
Reference Minimum Nominal Maximum
ddd
With Lead Finish
M
C A-B D
9
A
A1
A2
D
D1
E
E1
L
N
1.20
0.15
1.05
b
0.05
0.95
1.00
12.00
10.00
12.00
10.00
0.60
64
0.09/0.20
0.09/0.16
b
1
Base Metal
0.45
0.75
Detail A
e
b
b1
ccc
ddd
0.50
0.22
0.20
0.17
0.17
0.27
0.23
0.08
0.08
0° Min.
0.08/0.20 R.
H
A2
Min. R. 0.08
Min. 0.20
11
A1
0-7°
0.25
Gauge Plane
L
(1.00)
Notes
1. All dimensions and tolerances in millimeters.
9. Dimension b does not include dambar protrusion. Allowable
dambar protrusion is 0.08 mm total in excess of the b
dimension at maximum material condition. Dambar cannot be
located on the lower radius or the foot.
2. Datum plane H located at the mold parting line and coincident with
lead where lead exits plastic body at parting line.
3. Datums A-B and D to be determined at center line between leads
where leads exit plastic body at datum plane H.
10. This outline conforms to JEDEC MS-026, variation ACD.
11. A1 is defined as the distance from the seating plane to lowest
point of the package body.
4. To be determined at seating plane C.
5. Dimensions D1 and E1 do not include mold protrusion. Allowable
mold protrusion is 0.254 mm on D1 and E1 dimensions.
6. N is the total number of terminals.
12. Dimensions D2 and E2 represent the size of the exposed pad,
which is 3.8 mm x 3.8 mm typical.
7. To be determined at datum plane H.
13. Exposed pad is coplanar with the top of the package.
8. Package top dimensions are smaller than bottom dimensions, and
top of package does not overhang bottom of package.
17 of 22
G52212-0 Revision 4.7
March 14, 2008
VITESSE [ VITESSE SEMICONDUCTOR CORPORATION ]
