VSC7123
Datasheet
Package Thermal Considerations
The VSC7123QN, VSC7123XQN, and VSC7123QU use industry-standard EIAJ footprints that are enhanced to
improve thermal dissipation The construction of these packages is shown in the following illustration.
Figure 10. Package Cross-Section for VSC7123QN, VSC7123XQN, and VSC7123QU
Internal Heat Spreader
Plastic Molding Compound
Insulator
Lead
Die
Bond Wire
Note: The VSC7123RD, VSC7123XRD, VSC7123YW, and VSC7123XYW are packaged in an exposed pad TQFP.
There is no internal heat spreader in any of these four packages.
Moisture Sensitivity
Moisture sensitivity level ratings for Vitesse products comply with the joint IPC and JEDEC standard IPC/JEDEC
J-STD-020.
VSC7123RD, VSC7123XRD, VSC7123YW, VSC7123XYW, VSC7123QU, and VSC7123QN are rated moisture
sensitivity level 3 or better.
VSC7123XQN is rated moisture sensitivity level 4.
For more information, see the IPC and JEDEC standard.
Package Drawings
The following illustrations show the package drawings for the VSC7123 device.
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G52212-0 Revision 4.7
March 14, 2008
VITESSE [ VITESSE SEMICONDUCTOR CORPORATION ]
