X-band High Power Amplifier
Bonding recommendations
Port
IN
OUT
Vg
Vd
Connection
Inductance (Lbonding) = 0.35nH
2 gold wires with diameter of 25 µm (600µm max)
Inductance (Lbonding) = 0.35nH
2 gold wires with diameter of 25 µm (600µm max)
Inductance
≤
1nH
Inductance
≤
1nH
CHA7215
External capacitor
C1 ~ 100pF
C2 ~ 10nF
C1 ~ 100pF
Assembly recommendations in test fixture
Vg
Vd
Vg
Vd
C1=100pF
C2=10nF
Non capacitive pad
Recommended ESD management
Refer to the application note AN0020 available at
http://www.ums-gaas.com
for ESD
sensitivity and handling recommendations for the UMS products.
Ref : DSCHA72159287 - 14 Oct 09
7/8
Specifications subject to change without notice
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UMS [ UNITED MONOLITHIC SEMICONDUCTORS ]
