8-12GHz High Power Amplifier
Mechanical data
CHA6005-99F
Chip thickness: 70µm ±10µm.
Chip size: 3000 x 1500 ±35µm
All dimensions are in micrometers
RF pads (1, 10)
= 122 x 100µm²
DC pads (4, 6, 7, 8, 9)
= 100 x 100µm²
Pin number
1
2, 3, 5,8
4
6
7
8
9
10
Pin name
IN
-
VG1
VD1
VG2
GND
VD2
OUT
Description
Input RF
Not Connected
Vg1
Vd1
Not Connected
Not Connected
Vd2
Output RF
Ref. : DSCHA60052244 - 31 Aug 12
7/10
Specifications subject to change without notice
Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France
Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34