UCD8220, UCD8620
www.ti.com
SLUS652B–MARCH 2005–REVISED SEPTEMBER 2005
These devices have limited built-in ESD protection. The leads should be shorted together or the device
placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
CONNECTION DIAGRAMS
HTSSOP PACKAGE (PWP −16)
UCD8220 (TOP VIEW)
HTSSOP PACKAGE (PWP −16)
UCD8620 (TOP VIEW)
1
2
3
4
5
6
7
8
NC
CLK
3V3
ISET
AGND
CTRL
CLF
1
2
3
4
5
6
7
8
NC
CLK
3V3
ISET
AGND
CTRL
CLF
16
15
14
13
12
11
10
9
16
15
14
13
12
11
10
9
NC
NC
VIN
NC
VDD
PVDD
OUT1
OUT2
PGND
CS
VDD
PVDD
OUT1
OUT2
PGND
CS
ILIM
ILIM
NC − No internal connection
NC − No internal connection
QFN PACKAGE (RGW−20)
UCD8620 (BOTTOM VIEW)
QFN PACKAGE (RSA−16)
UCD8220 (BOTTOM VIEW)
1
2
3
4
9
1
2
3
4
5
16
5
6
7
8
CLK
NC
CLF
ILIM
NC
20
19
18
17
16
6
7
CLK
NC
NC
ILIM
NC
CS
15
14
13
8
NC
NC
9
VIN
NC
VDD
CS
10
NC
12 11 10
15 14 13 12 11
ORDERING INFORMATION
PACKAGED DEVICES(1)(2)(3)
110-V HV STARTUP
CIRCUIT
TEMPERATURE RANGE
-40°C to 105°C
PowerPAD™
HTSSOP-16 (PWP)
QFN-16 (RSA)(4)
QFN-20 (RGW)
No
UCD8220PWP
UCD8620PWP(5)
UCD8220RSA
-
-
Yes
UCD8620RGW
(1) HTSSOP-16 (PWP), QFN-16 (RSA), and QFN-20 (RGW) packages are available taped and reeled. Add R suffix to device type (e.g.
UCD8620PWPR) to order quantities of 2,000 devices per reel for the PWP package and 1,000 devices per reel for the RSA and RGW
packages.
(2) These products are packaged in Pb-Free and Green lead finish of Pd-Ni-Au which is compatible with MSL level 1 at 255°C to 260°C
peak reflow temperature to be compatible with either lead free or Sn/Pb soldering operations.
(3) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
(4) Contact factory for availability of QFN packaging.
(5) Product preview stage of development.
4
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