UCC28951
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ZHCSIQ7A –AUGUST 2018 –REVISED DECEMBER 2021
6.4 Thermal Information
UCC28951
THERMAL METRIC(1)
PW (TSSOP)
24 PINS
93.3
UNIT
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
24.2
47.9
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
0.7
ψJT
47.4
ψJB
RθJC(bot)
n/a
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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English Data Sheet: SLUSDB2
6
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