TVP5160
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SLES135E–FEBRUARY 2005–REVISED APRIL 2011
3
4
Internal Control Registers ................................................................................................... 38
3.1
Register Definitions ........................................................................................................ 43
VBUS Register Definitions ............................................................................................... 88
3.2
Typical Application Circuit .................................................................................................. 95
Typical Application Circuit ................................................................................................ 95
4.1
5
6
Typical Register Programming Sequence ............................................................................. 96
Electrical Specifications ..................................................................................................... 97
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
Absolute Maximum Ratings .............................................................................................. 97
Recommended Operating Conditions .................................................................................. 97
Crystal Specifications ..................................................................................................... 98
DC Electrical Characteristics ............................................................................................. 98
Analog Processing and A/D Converters ................................................................................ 99
Data Clock, Video Data, Sync Timing .................................................................................. 99
I2C Host Port Timing ..................................................................................................... 100
SDRAM Timing ........................................................................................................... 101
Example SDRAM Timing Alignment ................................................................................... 102
6.10 Memories Tested ......................................................................................................... 103
6.11 Thermal Specification ................................................................................................... 103
7
8
Designing With PowerPAD™ ............................................................................................. 104
Revision History .............................................................................................................. 106
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