TSC2007-Q1
SBAS545 –SEPTEMBER 2011
www.ti.com
VDD/REF
PENIRQ
X+
X-
Y+
Y-
Touch
Screen
Drivers
Interface
I2C
Serial
Interface
and
SAR
ADC
SCL
Mux
SDA
A[0:1]
TEMP
Control
AUX
Internal
Clock
GND
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
TA
PACKAGE
ORDERABLE PART NUMBER
TOP-SIDE MARKING
–40°C to +85°C
TSSOP – PW
Reel of 2000
TSC2007IPWRQ1
TS2007I
(1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or see
the TI website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS(1)
Over operating free-air temperature range (unless otherwise noted).
PARAMETER
Analog input X+, Y+, AUX to GND
VALUE
–0.4 to VDD + 0.1
–0.4 to VDD + 0.1
–0.3 to +5
–0.3 to VDD + 0.3
–0.3 to VDD + 0.3
(TJ Max - TA)/θJA
86
UNIT
V
V
V
V
V
Voltage
Analog input X–, Y– to GND
Voltage range
VDD/REF pin to GND
Digital input voltage to GND
Digital output voltage to GND
Power dissipation
Thermal impedance, θJA
TSSOP package
°C/W
°C
Operating free-air temperature range, TA
Storage temperature range, TSTG
Junction temperature, TJ Max
–40 to +85
–65 to +150
+150
°C
°C
Vapor phase (60 sec)
Infrared (15 sec)
X+, X–, Y+, Y–
+215
°C
Lead temperature
+220
°C
IEC contact discharge(2)
IEC air discharge(2)
±15
kV
X+, X–, Y+, Y–
±25
kV
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to
absolute-maximum rated conditions for extended periods may affect device reliability.
(2) Test method based on IEC standard 61000-4-2. Contact Texas Instruments for test details.
2
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