TPS61199
SLVSAN3 –DECEMBER 2010
www.ti.com
Table 1. PACKAGE INFORMATION(1)
PACKAGE
SOP – 20
PART NUMBER(2)
TPS61199NS
HTSSOP – 20
TPS61199PWP
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document; or, see the TI
Web site at www.ti.com.
(2) The SOP and HTSSOP package are available in tape and reel. Add R suffix (TPS61199PWPR / TPS61199NSR) to order quantities of
2000 parts per reel.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)(1)
VALUE
UNIT
MIN
–0.3
–0.3
–0.3
–0.3
–0.3
MAX
30
30
20
3.3
7
Pin VIN(2)
Pin IFB1 to IFB8(2)
Pin EN and PWM(2)
Pin ISET, ISNS and OVP(2)
All other pins(2)
Voltage Range
V
HBM ESD rating
2
KV
Continuous Power Dissipation
Operating Junction Temperature Range
Storage Temperature Range
See Thermal Information Table
–40
–65
+150
+150
°C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal
RECOMMENDED OPERATING CONDITIONS(1)
MIN NOM
MAX
UNIT
µH
L1
Inductor
10
10
22
47
C1
Input capacitor
µF
C2
Output capacitor
10
33
100
22
1
µF
fPWM
tPWM
fBOOST
TA
PWM dimming frequency
Rising/falling edge of PWM signal
Boost regulator switching frequency
Operating ambient temperature
0.1
KHz
µsec
kHz
°C
300
–40
800
85
(1) Customers need to verify the component values in their application if the values are different from the recommended values.
THERMAL INFORMATION
TPS61199
NS
TPS61199
PWP
20 PINS
46.9
THERMAL METRIC(1)
UNITS
20 PINS
69.4
qJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
qJCtop
qJB
36.4
48.2
37.3
22.1
°C/W
yJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
11.0
3.4
yJB
36.8
13.3
qJCbot
n/a
2.3
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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