www.ti.com
SLVS632 – JANUARY 2006
These devices have limited built-in ESD protection. The leads should be shorted together or the device
placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
T
J
–40°C to 125°C
(1)
OUTPUT VOLTAGE
Adjustable to 1.22 V
PACKAGE
Thermally Enhanced SOIC (DDA)
(1)
PART NUMBER
TPS5430DDA
The DDA package is also available taped and reeled. Add an R suffix to the device type (i.e., TPS5430DDAR). See applications section
of data sheet for PowerPAD™ drawing and layout information.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
VIN
ENA
VSENSE
V
I
Input voltage range
BOOT
BOOT-PH
PH (steady-state)
PH (transient < 10 ns)
I
O
I
O
T
J
T
STG
Source current
Leakage current
Storage temperature
Lead temperature 1,6 mm (1/16-inch) from case for 10 seconds
(1)
(2)
PH
PH
(1) (2)
VALUE
–0.3 to 38
–0.3 to 7
–0.3 to 3
–0.3 to 48
10
–0.6 to 38
–1.2
Internally Limited
10
–40 to 125
–65 to 150
300
UNIT
V
µA
°C
°C
°C
Operating virtual junction temperature range
Stresses beyond those listed under
absolute maximum ratings
may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under
recommended operating
conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal.
DISSIPATION RATINGS
(1) (2)
PACKAGE
8 Pin DDA (2-layer board with solder)
(3)
8 Pin DDA (4-layer board with solder)
(4)
(1)
(2)
THERMAL IMPEDANCE
JUNCTION-TO-AMBIENT
33°C/W
26°C/W
(3)
(4)
Maximum power dissipation may be limited by overcurrent protection.
Power rating at a specific ambient temperature T
A
should be determined with a junction temperature of 125°C. This is the point where
distortion starts to substantially increase. Thermal management of the final PCB should strive to keep the junction temperature at or
below 125°C for best performance and long-term reliability. See
Thermal Calculations
in applications section of this data sheet for more
information.
Test board conditions:
a. 3 in x 3 in, 2 layers, thickness: 0.062 inch.
b. 2 oz. copper traces located on the top and bottom of the PCB.
c. 6 thermal vias in the PowerPAD area under the device package.
Test board conditions:
a. 3 in x 3 in, 4 layers, thickness: 0.062 inch.
b. 2 oz. copper traces located on the top and bottom of the PCB.
c. 2 oz. copper ground planes on the 2 internal layers.
d. 6 thermal vias in the PowerPAD area under the device package.
RECOMMENDED OPERATING CONDITIONS
MIN
VIN
T
J
2
Input voltage range
Operating junction temperature
5.5
–40
NOM
MAX
36
125
UNIT
V
°C
TI [ TEXAS INSTRUMENTS ]
