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TPS54310-EP 参数 Datasheet PDF下载

TPS54310-EP图片预览
型号: TPS54310-EP
PDF下载: 下载PDF文件 查看货源
内容描述: 3 V至6 V的输入, 3 -A输出,具有集成FET的同步降压PWM切换器( SWIFT ™ ) [3-V TO 6-V INPUT, 3-A OUTPUT,SYNCHRONOUS BUCK PWM SWITCHER WITH INTEGRATED FETs(SWIFT™)]
分类和应用: 输出元件输入元件
文件页数/大小: 21 页 / 750 K
品牌: TI [ TEXAS INSTRUMENTS ]
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TPS54310-EP  
SLVS818APRIL 2008 ..................................................................................................................................................................................................... www.ti.com  
ANALOG GROUND TRACE  
FREQUENCY SET RESISTOR  
AGND  
RT  
SYNC  
SS/ENA  
VBIAS  
VIN  
SLOW START  
CAPACITOR  
VSENSE  
COMP  
COMPENSATION  
NETWORK  
PWRGD  
BOOT  
BIAS CAPACITOR  
EXPOSED  
POWERPAD  
AREA  
BOOT  
CAPACITOR  
Vin  
VIN  
PH  
PH  
PH  
PH  
PH  
VOUT  
VIN  
PGND  
PGND  
PGND  
OUTPUT INDUCTOR  
PH  
INPUT  
BYPASS  
INPUT  
BULK  
CAPACITOR  
FILTER  
OUTPUT  
FILTER  
CAPACITOR  
TOPSIDE GROUND AREA  
VIA to Ground Plane  
Figure 11. TPS54310 PCB Layout  
LAYOUT CONSIDERATIONS FOR THERMAL  
PERFORMANCE  
For operation at full rated load current, the analog  
ground plane must provide adequate heat dissipating  
area. A 3 inch by 3 inch plane of 1 ounce copper is  
recommended, though not mandatory, depending on  
ambient temperature and airflow. Most applications  
have larger areas of internal ground plane available,  
and the PowerPAD should be connected to the  
largest area available. Additional areas on the top or  
bottom layers also help dissipate heat, and any area  
available should be used when 3 A or greater  
operation is desired. Connection from the exposed  
area of the PowerPAD to the analog ground plane  
layer should be made using 0.013 inch diameter vias  
to avoid solder wicking through the vias. Six vias  
should be in the PowerPAD area with four additional  
vias located under the device package. The size of  
the vias under the package, but not in the exposed  
thermal pad area, can be increased to 0.018.  
Additional vias beyond the ten recommended that  
enhance thermal performance should be included in  
areas not under the device package.  
10  
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Copyright © 2008, Texas Instruments Incorporated  
Product Folder Link(s): TPS54310-EP