TPS2148
TPS2158
SLVS373 – AUGUST 2001
DGN (S-PDSO-G8)
PowerPAD PLASTIC SMALL-OUTLINE PACKAGE
0,38
0,25
0,65
M
0,25
8
5
Thermal Pad
(See Note D)
0,15 NOM
3,05
2,95
4,98
4,78
Gage Plane
0,25
0°–6°
1
4
0,69
0,41
3,05
2,95
Seating Plane
0,10
0,15
0,05
1,07 MAX
4073271/A 04/98
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions include mold flash or protrusions.
D. The package thermal performance may be enhanced by attaching an external heat sink to the thermal pad.
This pad is electrically and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MO-187
PowerPAD is a trademark of Texas Instruments.
17
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