Silicon Errata
SPRZ272F – September 2007 – Revised April 2011
TMS320F2833x and TMS320F2823x DSC Silicon Errata
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Introduction
This document describes the silicon updates to the functional specifications for the TMS320F2833x and
TMS320F2823x digital signal controllers (DSCs).
The updates are applicable to:
• 179-ball MicroStar BGA™, ZHH Suffix
• 176-ball Plastic BGA, ZJZ Suffix
• 176-pin Low-profile Thin Quad Flatpack, PGF Suffix
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Device and Development Support Tool Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
[TMS320] DSP devices and support tools. Each TMS320™ DSP commercial family member has one of
three prefixes: TMX, TMP, or TMS (e.g.,
TMS320F28335).
Texas Instruments recommends two of three
possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary
stages of product development from engineering prototypes (TMX/TMDX) through fully qualified
production devices/tools (TMS/TMDS).
TMX
TMP
TMS
Experimental device that is not necessarily representative of the final device's electrical
specifications
Final silicon die that conforms to the device's electrical specifications but has not
completed quality and reliability verification
Fully qualified production device
Support tool development evolutionary flow:
TMDX
Development-support product that has not yet completed Texas Instruments internal
qualification testing
TMDS
Fully qualified development-support product
TMX and TMP devices and TMDX development-support tools are shipped against the following
disclaimer:
"Developmental product is intended for internal evaluation purposes."
TMS devices and TMDS development-support tools have been characterized fully, and the quality and
reliability of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard
production devices. Texas Instruments recommends that these devices not be used in any production
system because their expected end-use failure rate still is undefined. Only qualified production devices are
to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, ZJZ) and temperature range (for example, A).
MicroStar BGA, TMS320 are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
SPRZ272F – September 2007 – Revised April 2011
TMS320F2833x and TMS320F2823x DSC Silicon Errata
© 2007–2011, Texas Instruments Incorporated
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