TMS320TCI6487
TMS320TCI6488
Communications Infrastructure Digital Signal Processor
SPRS358F–APRIL 2007–REVISED AUGUST 2008
www.ti.com
9 Mechanical Data
9.1 Thermal Data
Table 9-1 shows the thermal resistance characteristics for the PBGA—CUN/GUN/ZUN—mechanical
package.
Table 9-1. Thermal Resistance Characteristics (PBGA Package) [CUN/GUN/ZUN](1)
AIR FLOW
NO.
PARAMETER
°C/W
(m/s)(2)
N/A
1
2
RΘJC
RΘJB
Junction-to-case
Junction-to-board
0.30
6.5
N/A
(1) A heatsink is required for proper device operation.
(2) m/s = meters per second
9.2 Packaging Information
The following packaging information reflects the most current released data available for the designated
device(s). This data is subject to change without notice and without revision of this document.
202
Mechanical Data
Submit Documentation Feedback
TI [ TEXAS INSTRUMENTS ]
