TMS320DM6437
Digital Media Processor
www.ti.com
SPRS345B–NOVEMBER 2006–REVISED MARCH 2007
7.1.1 Thermal Data for ZDU
Table 7-2. Thermal Resistance Characteristics (PBGA Package) [ZDU]
NO.
1
°C/W(1)
7.7
AIR FLOW (m/s)(2)
RΘJC
RΘJB
Junction-to-case
Junction-to-board
N/A
N/A
0.00
1.0
2
10.5
19.7
15.5
14.3
4.9
3
4
RΘJA
PsiJT
PsiJB
Junction-to-free air
Junction-to-package top
Junction-to-board
5
2.00
0.00
1.0
7
8
5.1
9
5.2
2.00
0.00
1.0
11
12
13
10.4
9.8
9.6
2.00
(1) The junction-to-case measurement was conducted in a JEDEC defined 1S0P system. Other measurements were conducted in a JEDEC
defined 1S2P system and will change based on environment as well as application.
For more information, see these three EIA/JEDEC standards:
•
•
•
EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
EIA/JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
(2) m/s = meters per second
7.1.2 Packaging Information
The following packaging information and addendum reflect the most current data available for the
designated device(s). This data is subject to change without notice and without revision of this document.
Submit Documentation Feedback
Mechanical Data
305
TI [ TEXAS INSTRUMENTS ]
