TMS320DM6437
Digital Media Processor
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SPRS345B–NOVEMBER 2006–REVISED MARCH 2007
7 Mechanical Data
The following table(s) show the thermal resistance characteristics for the PBGA–ZWT and ZDU
mechanical package(s).
TBD see Power Application Report
7.1 Thermal Data for ZWT
Table 7-1. Thermal Resistance Characteristics (PBGA Package) [ZWT]
NO.
1
°C/W(1)
5.4
AIR FLOW (m/s)(2)
RΘJC
RΘJB
Junction-to-case
Junction-to-board
N/A
N/A
0.00
1.0
2
16.0
26.6
21.9
20.4
0.0
3
4
RΘJA
PsiJT
PsiJB
Junction-to-free air
Junction-to-package top
Junction-to-board
5
2.00
0.00
1.0
7
8
0.1
9
0.2
2.00
0.00
1.0
11
12
13
15.9
15.8
15.3
2.00
(1) The junction-to-case measurement was conducted in a JEDEC defined 1S0P system. Other measurements were conducted in a JEDEC
defined 1S2P system and will change based on environment as well as application.
For more information, see these three EIA/JEDEC standards:
•
•
EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
EIA/JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•
.
(2) m/s = meters per second
304
Mechanical Data
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