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TMS320C6678XCYP25 参数 Datasheet PDF下载

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型号: TMS320C6678XCYP25
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内容描述: 多核固定和浮点数字信号处理器 [Multicore Fixed and Floating-Point Digital Signal Processor]
分类和应用: 数字信号处理器
文件页数/大小: 242 页 / 2088 K
品牌: TI [ TEXAS INSTRUMENTS ]
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TMS320C6678  
Multicore Fixed and Floating-Point Digital Signal Processor  
SPRS691D—April 2013  
www.ti.com  
Table 2-2  
Memory Map Summary (Part 7 of 7)  
Logical 32-bit Address  
Physical 36-bit Address  
Start  
End  
Start  
End  
Bytes  
512  
Description  
21000000  
21000200  
21400000  
21400100  
21800000  
21808000  
34000000  
34200000  
40000000  
50000000  
60000000  
70000000  
74000000  
78000000  
7C000000  
80000000  
End of Table 2-2  
210001FF  
213FFFFF  
214000FF  
217FFFFF  
21807FFF  
33FFFFFF  
341FFFFF  
3FFFFFFF  
4FFFFFFF  
5FFFFFFF  
6FFFFFFF  
73FFFFFF  
77FFFFFF  
7BFFFFFF  
7FFFFFFF  
FFFFFFFF  
1 00000000  
0 21000200  
0 21400000  
0 21400100  
0 21800000  
0 21808000  
0 34000000  
0 34200000  
0 40000000  
0 50000000  
0 60000000  
0 70000000  
0 74000000  
0 78000000  
0 7C000000  
8 00000000  
1 000001FF  
0 213FFFFF  
0 214000FF  
0 217FFFFF  
0 21807FFF  
0 33FFFFFF  
0 341FFFFF  
0 3FFFFFFF  
0 4FFFFFFF  
0 5FFFFFFF  
0 6FFFFFFF  
0 73FFFFFF  
0 77FFFFFF  
0 7BFFFFFF  
0 7FFFFFFF  
8 7FFFFFFF  
DDR3 EMIF configuration  
4M-512  
256  
Reserved  
HyperLink config  
4M-256  
32K  
Reserved  
PCIe config  
296M-32K  
2M  
Reserved  
Queue manager subsystem data  
190M  
256M  
256M  
256M  
64M  
Reserved  
HyperLink data  
Reserved  
PCIe data  
EMIF16 CE0 data space, supports NAND, NOR or SRAM memory(1)  
EMIF16 CE1 data space, supports NAND, NOR or SRAM memory(1)  
EMIF16 CE2 data space, supports NAND, NOR or SRAM memory(1)  
EMIF16 CE3 data space, supports NAND, NOR or SRAM memory(1)  
DDR3 EMIF data (2)  
64M  
64M  
64M  
2G  
1 32MB per chip select for 16-bit NOR and SRAM. 16MB per chip select for 8-bit NOR and SRAM. The 32MB and 16MB size restrictions do not apply to NAND.  
2 The memory map only shows the default MPAX configuration of DDR3 memory space. For the extended DDR3 memory space access (up to 8GB), please refer to the MPAX  
configuration details in C66x CorePac User Guide and Multicore Shared Memory Controller (MSMC) for KeyStone Devices User Guide in ‘‘Related Documentation from Texas  
Instruments’’ on page 73.  
2.4 Boot Sequence  
The boot sequence is a process by which the DSP's internal memory is loaded with program and data sections. The  
DSP's internal registers are programmed with predetermined values. The boot sequence is started automatically  
after each power-on reset, warm reset, and system reset. A local reset to an individual C66x CorePac should not affect  
the state of the hardware boot controller on the device. For more details on the initiators of the resets, see section  
7.4 ‘‘Reset Controller’’ on page 132. The bootloader uses a section of the L2 SRAM (start address 0x0087 2DC0 and  
end address 0x0087 FFFF) during initial booting of the device. For more details on the type of configurations stored  
in this reserved L2 section see Table 2-3.  
Table 2-3  
Bootloader section in L2 SRAM (Part 1 of 2)  
Start Address (Hex)  
0x00872DC0  
0x00872E00  
0x00873200  
0x008732E0  
0x00873300  
0x00873400  
0x00873420  
0x00873500  
0x00873600  
0x00873680  
0x00873700  
0x00878000  
Size (Hex Bytes)  
0x40  
Description  
ROM boot version string (Unreserved)  
Boot code stack  
0x400  
0xE0  
Boot log  
0x20  
Boot progress register stack (copies of boot program on mode change)  
Boot Internal Stats  
0x100  
0x20  
Boot table arguments  
0xE0  
ROM boot FAR data  
0x100  
0x80  
DDR configuration table  
RAM table  
0x80  
Boot parameter table  
0x4900  
0x7F80  
Clear text packet scratch  
Ethernet/SRIO packet/message/descriptor memory  
Copyright 2013 Texas Instruments Incorporated  
Device Overview 27  
 
 
 
 
 
 
 
 
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