ꢀ ꢁ ꢂ ꢃ ꢄꢅ ꢆ ꢇ ꢈꢉ ꢈꢀꢊ ꢀꢁ ꢂꢃ ꢄ ꢅ ꢆꢇ ꢈ ꢉ ꢋꢀꢊ ꢀꢁ ꢂꢃ ꢄ ꢅ ꢆꢇ ꢈ ꢉ ꢇ ꢀ
ꢌ ꢍ ꢎꢏ ꢐꢑꢒ ꢓꢍ ꢔ ꢀ ꢐꢍ ꢕ ꢍ ꢀꢖꢗ ꢂ ꢍ ꢕꢔ ꢖꢗ ꢒ ꢘꢓ ꢆꢏ ꢂꢂꢓ ꢘꢂ
SPRS226H − NOVEMBER 2003 − REVISED AUGUST 2005
MECHANICAL DATA FOR C6414T, C6415T, AND C6416T
The following table(s) show the thermal resistance characteristics for the PBGA — GLZ and ZLZ mechanical
packages.
thermal resistance characteristics (S-PBGA package) [GLZ]
°C/W
(with Heat Sink )
†
‡
NO.
Air Flow (m/s )
°C/W
§
1
2
3
4
5
6
7
8
RΘ
RΘ
RΘ
RΘ
RΘ
RΘ
Junction-to-case
N/A
N/A
0.00
0.5
3.11
9.95
19.6
17.3
15.6
14.7
0.83
7.88
3.11
9.95
14.4
11.5
9.3
JC
JB
JA
JA
JA
JA
JT
JB
Junction-to-board
Junction-to-free air
Junction-to-free air
Junction-to-free air
Junction-to-free air
Junction-to-package top
Junction-to-board
1.0
2.00
N/A
N/A
8.0
Psi
Psi
0.83
7.88
†
‡
§
m/s = meters per second
Numbers are based on simulations.
These thermal resistance numbers were modeled using a heat sink, part number 374024B00035, manufactured by AAVID Thermalloy. AAVID
Thermalloy also manufactures a similar epoxy-mounted heat sink, part number 374024B00000. When operating at 1 GHz, a heat sink is
required to reduce the thermal resistance characteristics of the package. TI recommends a passive, laminar heat sink, similar to the part
numbers mentioned above.
thermal resistance characteristics (S-PBGA package) [ZLZ]
°C/W
(with Heat Sink )
†
‡
NO.
Air Flow (m/s )
°C/W
§
1
2
3
4
5
6
7
RΘ
RΘ
RΘ
RΘ
RΘ
RΘ
Junction-to-case
N/A
N/A
0.00
0.5
3.11
9.95
19.6
17.3
15.6
14.7
0.83
3.11
9.95
14.4
11.5
9.3
JC
JB
JA
JA
JA
JA
JT
Junction-to-board
Junction-to-free air
Junction-to-free air
Junction-to-free air
Junction-to-free air
Junction-to-package top
1.0
2.00
N/A
8.0
Psi
Psi
0.83
8
Junction-to-board
N/A
7.88
7.88
JB
†
‡
§
m/s = meters per second
Numbers are based on simulations.
These thermal resistance numbers were modeled using a heat sink, part number 374024B00035, manufactured by AAVID Thermalloy. AAVID
Thermalloy also manufactures a similar epoxy-mounted heat sink, part number 374024B00000. When operating at 1 GHz, a heat sink is
required to reduce the thermal resistance characteristics of the package. TI recommends a passive, laminar heat sink, similar to the part
numbers mentioned above.
134
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