TLK10002
www.ti.com
SLLSE75 –MAY 2011
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)(1)
VALUE
MAX
UNIT
MIN
–0.3
–0.3
–0.3
–65
1
Supply voltage
DVDD, VDDA_LS/HS, VDDT_LS/HS, VPP, VDDD
VDDRA_LS/HS, VDDRB_LS/HS, VDDO[1:0]
VI, (LVCMOS/LVDS/LVPECL/CML/Analog)
1.4
2.2
V
V
Supply voltage
Input voltage
Supply + 0.3 V
150
V
Storage temperature
Electrostatic discharge
°C
KV
V
HBM
CDM
500
–40
Characterized free-air operating temperature range
85
°C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION - JEDEC High-K PCB
TLK10002
THERMAL METRIC(1)
PBGA
144 PINS
25.5
UNITS
θJA
Junction-to-ambient thermal resistance
θJCtop
θJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
2.8
18
°C/W
ψJT
ψJB
Junction-to-top characterization parameter
Junction-to-board characterization parameter
1.8
13.7
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION - EVM Board (5in. x 7in., 14 layer, 1-oz. copper)
TLK10002
THERMAL METRIC(1)
PBGA
144 PINS
24.5
2.8
UNITS
θJA
Junction-to-ambient thermal resistance
θJCtop
θJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
12
°C/W
ψJT
ψJB
Junction-to-top characterization parameter
Junction-to-board characterization parameter
0.9
11
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Copyright © 2011, Texas Instruments Incorporated
53
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