PACKAGE OPTION ADDENDUM
www.ti.com
11-Oct-2010
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
Samples Not Available
Samples Not Available
Samples Not Available
Samples Not Available
Samples Not Available
Samples Not Available
Samples Not Available
Purchase Samples
OPA140AID
OPA140AIDBVR
OPA140AIDBVT
OPA140AIDGKT
OPA140AIDR
PREVIEW
PREVIEW
PREVIEW
PREVIEW
PREVIEW
PREVIEW
PREVIEW
ACTIVE
SOIC
SOT-23
SOT-23
MSOP
SOIC
D
8
5
5
8
8
8
8
8
75
TBD
TBD
TBD
TBD
TBD
TBD
TBD
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DBV
DBV
DGK
D
3000
250
250
2500
OPA140IDGKR
OPA2140AID
MSOP
SOIC
DGK
D
75
OPA2140AIDGKR
MSOP
DGK
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
OPA2140AIDGKT
ACTIVE
MSOP
DGK
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Request Free Samples
OPA2140AIDR
OPA4140AID
PREVIEW
PREVIEW
PREVIEW
PREVIEW
PREVIEW
SOIC
SOIC
D
D
8
2500
50
TBD
TBD
TBD
TBD
TBD
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Samples Not Available
Samples Not Available
Samples Not Available
Samples Not Available
Samples Not Available
14
14
14
14
OPA4140AIDR
OPA4140AIPW
OPA4140AIPWR
SOIC
D
2500
90
TSSOP
TSSOP
PW
PW
2000
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 1