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OMAP-L137 参数 Datasheet PDF下载

OMAP-L137图片预览
型号: OMAP-L137
PDF下载: 下载PDF文件 查看货源
内容描述: 低功耗应用处理器 [Low-Power Applications Processor]
分类和应用:
文件页数/大小: 219 页 / 1837 K
品牌: TI [ TEXAS INSTRUMENTS ]
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OMAP-L137 Low-Power Applications Processor  
www.ti.com  
SPRS563ASEPTEMBER 2008REVISED OCTOBER 2008  
6.11.1 Interfacing to SDRAM  
The EMIFB supports a glueless interface to SDRAM devices with the following characteristics:  
Pre-charge bit is A[10]  
The number of column address bits is 8, 9, 10 or 11  
The number of row address bits is 13 (in case of mobile SDR, number of row address bits can be 9,  
10, 11, 12, or 13)  
The number of internal banks is 1, 2 or 4  
Figure 6-20 shows an interface between the EMIFB and a 2M × 16 × 4 bank SDRAM device. In addition,  
Figure 6-21 shows an interface between the EMIFB and a 2M × 32 × 4 bank SDRAM device and  
Figure 6-22 shows an interface between the EMIFB and two 4M × 16 × 4 bank SDRAM devices. Refer to  
Table 6-22, as an example that shows additional list of commonly-supported SDRAM devices and the  
required connections for the address pins. Note that in Table 6-22, page size/column size (not indicated in  
the table) is varied to get the required addressability range.  
SDRAM  
2M x 16 x 4  
Bank  
EMIFB  
EMB_CS  
CE  
EMB_CAS  
EMB_RAS  
CAS  
RAS  
WE  
EMB_WE  
EMB_CLK  
CLK  
CKE  
EMB_SDCKE  
EMB_BA[1:0]  
EMB_A[11:0]  
EMB_WE_DQM[0]  
EMB_WE_DQM[1]  
EMB_D[15:0]  
BA[1:0]  
A[11:0]  
LDQM  
UDQM  
DQ[15:0]  
Figure 6-20. EMIFB to 2M × 16 × 4 bank SDRAM Interface  
SDRAM  
2M x 32 x 4  
Bank  
EMIFB  
EMB_CS  
CE  
EMB_CAS  
EMB_RAS  
CAS  
RAS  
WE  
EMB_WE  
EMB_CLK  
CLK  
CKE  
EMB_SDCKE  
EMB_BA[1:0]  
EMB_A[11:0]  
EMB_WE_DQM[3:0]  
EMB_D[31:0]  
BA[1:0]  
A[11:0]  
DQM[3:0]  
DQ[31:0]  
Figure 6-21. EMIFB to 2M × 32 × 4 bank SDRAM Interface  
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Peripheral Information and Electrical Specifications  
115  
 
 
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