MSP430FR573x
MSP430FR572x
SLAS639D – JULY 2011 – REVISED AUGUST 2012
Pin Designation –
MSP430FR5730IYFF, MSP430FR5736IYFF, MSP430FR5738IYFF
YFF PACKAGE
(TOP VIEW)
NC
1
P1.1
A2
AVCC
B2
AVSS
C2
DVSS
D2
P1.6
E2
P1.2
A3
AVSS
B3
PJ.0
C3
P1.3
A4
P1.4
B4
PJ.2
C4
P1.5
A5
PJ.1
B5
PJ.3
C5
A1
PJ.5
B1
PJ.4
C1
DVCC
D1
VCORE
E1
P2.1 RST/NMI TEST
D3
P1.7
E3
D4
P2.2
E4
D5
P2.0
E5
1
NC (no connect). This ball must be attached but remain floating (no electrical connection).
P1.0 must be initialized properly to avoid the floating input of the device.
Package Dimensions:
The package dimensions for the YFF package are shown in
See the package
drawing at the end of this data sheet for more details.
Table 3. YFF Package Dimensions
PACKAGED DEVICES
MSP430FR5738IYFF
MSP430FR5736IYFF
MSP430FR5730IYFF
2.04 ± 0.03
2.24 ± 0.03
D
E
Copyright © 2011–2012, Texas Instruments Incorporated
11
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