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MSP430F6630IPZR 参数 Datasheet PDF下载

MSP430F6630IPZR图片预览
型号: MSP430F6630IPZR
PDF下载: 下载PDF文件 查看货源
内容描述: 混合信号微控制器 [MIXED SIGNAL MICROCONTROLLER]
分类和应用: 微控制器
文件页数/大小: 116 页 / 1284 K
品牌: TI [ TEXAS INSTRUMENTS ]
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MSP430F663x  
www.ti.com  
SLAS566C JUNE 2010REVISED AUGUST 2012  
12-Bit DAC, Reference Input Specifications  
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
DAC12IR = 0(1) (2)  
VCC  
MIN  
TYP  
MAX UNIT  
AVCC AVCC  
/ 3  
+ 0.2  
Reference input voltage  
range  
VeREF+  
2.2 V, 3 V  
V
AVCC  
+ 0.2  
DAC12IR = 1(3) (4)  
AVCC  
DAC12_0 IR = DAC12_1 IR = 0  
DAC12_0 IR = 1, DAC12_1 IR = 0  
DAC12_0 IR = 0, DAC12_1 IR = 1  
20  
MΩ  
48  
48  
Ri(VREF+)  
Ri(VeREF+)  
,
Reference input resistance(5)  
2.2 V, 3 V  
kΩ  
DAC12_0 IR = DAC12_1 IR = 1,  
24  
DAC12_0 SREFx = DAC12_1 SREFx(6)  
(1) For a full-scale output, the reference input voltage can be as high as 1/3 of the maximum output voltage swing (AVCC).  
(2) The maximum voltage applied at reference input voltage terminal VeREF+ = [AVCC – VE(O)] / [3 × (1 + EG)].  
(3) For a full-scale output, the reference input voltage can be as high as the maximum output voltage swing (AVCC).  
(4) The maximum voltage applied at reference input voltage terminal VeREF+ = [AVCC – VE(O)] / (1 + EG).  
(5) This impedance depends on tradeoff in power savings. Current devices have 48 kfor each channel when divide is enabled. Can be  
increased if performance can be maintained.  
(6) When DAC12IR = 1 and DAC12SREFx = 0 or 1 for both channels, the reference input resistive dividers for each DAC are in parallel  
reducing the reference input resistance.  
12-Bit DAC, Dynamic Specifications  
VREF = VCC, DAC12IR = 1 (see Figure 19 and Figure 20), over recommended ranges of supply voltage and operating free-air  
temperature (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
DAC12AMPx = 0 {2, 3, 4}  
VCC  
MIN  
TYP  
60  
MAX UNIT  
120  
DAC12_xDAT = 800h,  
ErrorV(O) < ±0.5 LSB(1)  
(see Figure 19)  
tON  
DAC12 on time  
DAC12AMPx = 0 {5, 6}  
DAC12AMPx = 0 7  
DAC12AMPx = 2  
2.2 V, 3 V  
15  
30  
12  
µs  
µs  
µs  
6
100  
40  
200  
80  
DAC12_xDAT =  
tS(FS)  
tS(C-C)  
SR  
Settling time, full scale  
DAC12AMPx = 3, 5  
DAC12AMPx = 4, 6, 7  
DAC12AMPx = 2  
2.2 V, 3 V  
2.2 V, 3 V  
80h F7Fh 80h  
15  
30  
5
DAC12_xDAT =  
Settling time, code to  
code  
3F8h 408h 3F8h,  
BF8h C08h BF8h  
DAC12AMPx = 3, 5  
DAC12AMPx = 4, 6, 7  
DAC12AMPx = 2  
2
1
0.05  
0.35  
1.50  
0.35  
1.10  
5.20  
DAC12_xDAT =  
Slew rate  
DAC12AMPx = 3, 5  
DAC12AMPx = 4, 6, 7  
2.2 V, 3 V  
2.2 V, 3 V  
V/µs  
nV-s  
80h F7Fh 80h(2)  
DAC12_xDAT =  
Glitch energy  
DAC12AMPx = 7  
35  
800h 7FFh 800h  
(1) RLoad and CLoad connected to AVSS (not AVCC/2) in Figure 19.  
(2) Slew rate applies to output voltage steps 200 mV.  
Conversion 1  
Conversion 2  
1/2 LꢀS  
Conversion 3  
VOUT  
DAC Output  
RLoad = 3 kW  
ILoad  
Glitch  
Energy  
AVCC  
2
1/2 LꢀS  
CLoad = 100 pF  
RO/P(DAC12.x)  
tsettleLH  
tsettleHL  
Figure 19. Settling Time and Glitch Energy Testing  
Copyright © 2010–2012, Texas Instruments Incorporated  
77  
 
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