MSP-TS430PN80USB
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Table B-21. MSP-TS430PN80USB Bill of Materials
No. per
Board
Pos.
Ref Des
Description
DigiKey Part No.
Comment
DNP: C1, C2
1
1.1
2
C1, C2
C3, C4
C6, C7
0
2
2
12pF, SMD0805
47pF, SMD0805
10uF/6.3V, Tantal Size B
511-1463-2-ND
C5, C11,
C13, C14
3
4
100nF, SMD0805
311-1245-2-ND
311-1245-2-ND
3.1
4
C10, C12
C8
0
1
1
1
10uF, SMD0805
DNP: C10, C12
2.2nF, SMD0805
470nF, SMD0805
green LED, SMD0805
5
C9
478-1403-2-ND
P516TR-ND
6
D1
DNP: headers and
receptacles enclosed with
kit. Keep vias free of
solder.: Header:
J1, J2, J3,
J4
7
4
4
20-pin header, TH
20-pin header, TH
SAM1029-20-ND
SAM1213-20-ND
Receptacle
DNP: headers and
receptacles enclosed with
kit. Keep vias free of
solder.: Header:
7.1
Receptacle
8
9
J5
1
6
3-pin header, male, TH
3-pin header, male, TH
2-pin header, male, TH
SAM1035-03-ND
SAM1035-03-ND
JP5, JP6,
JP7,
JP8,JP9,
JP10
Place jumpers on pins 2-3
Place jumper on header
10
JP1, JP2
2
1
1
SAM1035-02-ND
SAM1035-02-ND
SAM1035-03-ND
Place jumper only on one
pin
JP4
11
12
13
14
JP3
3-pin header, male, TH
Jumper
Place jumper on pins 1-2
Place on: JP1, JP2, JP3,
JP4, JP5, JP6, JP7, JP8,
JP9, JP10
10
1
15-38-1024-ND
JTAG
Q1
14-pin connector, male, TH HRP14H-ND
Micro Crystal MS1V-T1K
Crystal
DNP: Q1 Keep vias free of
solder
0
32.768kHz, C(Load) =
12.5pF
"Q2: 4MHzBuerklin:
78D134"
15
16
Q2
1
2
Crystal
R3, R7
330 Ω, SMD0805
541-330ATR-ND
541-000ATR-ND
Buerklin: 07E500
R1, R2, R4,
R6, R8, R9,
R12
17
2
0 Ω, SMD0805
DNP: R4, R6, R8, R9, R12
DNP
18
18
18
19
20
R10
R11
R5
1
0
1
1
1
100 Ω, SMD0805
1M Ω, SMD0805
47k Ω, SMD0805
Socket:IC201-0804-014
79 x 77 mm
541-47000ATR-ND
U1
Manuf.: Yamaichi
2 layers
PCB
Rubber
standoff
Apply to corners at bottom
side
21
22
4
2
Buerklin: 20H1724
DNP: Enclosed with kit
supplied by TI
MSP430
MSP430F5529
http://www.ettinger.de/Art_
Detail.cfm?ART_ARTNUM
=70.08.121
Insulating
disk to Q2
23
1
Insulating disk to Q2
27
28
C33
C35
1
1
220n
10p
Buerklin: 53D2074
Buerklin: 56D102
94
Hardware
SLAU278F–May 2009–Revised December 2010
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