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MSP-FET430UIF 参数 Datasheet PDF下载

MSP-FET430UIF图片预览
型号: MSP-FET430UIF
PDF下载: 下载PDF文件 查看货源
内容描述: MSP430硬件工具用户指南 [MSP430 Hardware Tools User Guide]
分类和应用:
文件页数/大小: 138 页 / 6499 K
品牌: TI [ TEXAS INSTRUMENTS ]
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www.ti.com  
MSP-TS430PN80USB  
Table B-20. MSP-TS430PN80A Bill of Materials  
No. per  
Board  
Position  
Ref Des  
Description  
DigiKey Part No.  
Comment  
1
2
C1, C2  
C3, C4  
0
0
12pF, SMD0805  
47pF, SMD0805  
DNP  
DNP  
C6, C7,  
C10, C12  
3
3
10uF/6.3V, SMD0805  
DNP C10  
C5, C11,  
C13, C14,  
C15  
4
5
100nF, SMD0805  
311-1245-2-ND  
478-1403-2-ND  
5
6
7
8
9
C8  
C9  
1
1
1
1
1
2.2nF, SMD0805  
470nF, SMD0805  
4.7uF, SMD0805  
220nF, SMD0805  
green LED, SMD0805  
C16  
C17  
D1  
P516TR-ND  
SAM1029-20-ND  
(Header)  
SAM1213-20-ND  
(Receptacle)  
DNP: Headers and receptacles  
enclosed with kit. Keep vias free of  
solder:  
J1, J2, J3,  
J4  
10  
11  
12  
0
2
7
20-pin header, TH  
J5 , J6  
3-pin header, male, TH  
3-pin header, male, TH  
JP3, JP5,  
JP6, JP7,  
JP8, JP9,  
JP10  
place jumpers on pins 2-3 on JP5,  
JP6, JP7, JP8, JP9, JP10 place  
jumpers on pins 1-2 on JP3,  
SAM1035-03-ND  
JP1, JP2,  
JP4  
13  
14  
15  
3
10  
1
2-pin header, male, TH  
Jumper  
SAM1035-02-ND  
15-38-1024-ND  
HRP14H-ND  
Place jumper on header  
See Pos. 12 and Pos. 13  
14-pin connector, male,  
TH  
JTAG  
10-pin connector, male,  
TH  
16  
17  
18  
19  
BOOTST  
0
0
0
0
"DNP Keep vias free of solder"  
DNP: Q1 Keep vias free of solder  
DNP: Q2 Keep vias free of solder  
Micro Crystal MS3V-T1R  
32.768kHz, C(Load) =  
12.5pF  
Q1  
Q2  
Crystal  
Q2: 4MHz Buerklin:  
78D134  
Crystal  
http://www.ettinger.de/Ar  
t_Detail.cfm?ART_ART  
NUM=70.08.121  
Insulating  
disk to Q2  
Insulating disk to Q2  
20  
21  
D3,D4  
2
2
LL103A  
Buerklin: 24S3406  
541-330ATR-ND  
R3, R7  
330 Ω, SMD0805  
R1, R2,  
R4, R6,  
R8,  
22  
3
0 Ohm, SMD0805  
541-000ATR-ND  
DNP: R6, R8, R9, R10, R11,R12  
R9,R10,  
R11, R12  
23  
24  
25  
R5  
U1  
1
1
1
47k Ω, SMD0805  
Socket:IC201-0804-014  
77 x 91 mm  
541-47000ATR-ND  
Manuf.: Yamaichi  
2 layers  
PCB  
Adhesive  
plastic feet  
about 6mm width, 2mm e.g., 3M Bumpons Part  
26  
27  
4
2
Apply to corners at bottom side  
height  
No. SJ-5302  
MSP430  
MSP430F5329IPN  
DNP: enclosed with kit, supplied by TI  
B.20 MSP-TS430PN80USB  
Due to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately  
0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for  
example, to run the MCU at 3.0 V, set it to 3.3 V.  
91  
SLAU278FMay 2009Revised December 2010  
Hardware  
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© 2009–2010, Texas Instruments Incorporated  
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