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LM26420XMH/NOPB 参数 Datasheet PDF下载

LM26420XMH/NOPB图片预览
型号: LM26420XMH/NOPB
PDF下载: 下载PDF文件 查看货源
内容描述: [双路 2A 高效同步直流/直流转换器 | PWP | 20 | -40 to 125]
分类和应用: 信息通信管理开关光电二极管转换器
文件页数/大小: 44 页 / 1515 K
品牌: TI [ TEXAS INSTRUMENTS ]
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LM26420, LM26420-Q0, LM26420-Q1  
www.ti.com  
SNVS579J FEBRUARY 2009REVISED SEPTEMBER 2015  
10 Layout  
10.1 Layout Guidelines  
When planning layout there are a few things to consider when trying to achieve a clean, regulated output. The  
most important consideration is the close coupling of the GND connections of the input capacitor and the PGND  
pin. These ground ends should be close to one another and be connected to the GND plane with at least two  
through-holes. Place these components as close to the device as possible. Next in importance is the location of  
the GND connection of the output capacitor, which should be near the GND connections of VIND and PGND.  
There should be a continuous ground plane on the bottom layer of a two-layer board except under the switching  
node island. The FB pin is a high impedance node and care should be taken to make the FB trace short to avoid  
noise pickup and inaccurate regulation. The feedback resistors should be placed as close as possible to the  
device, with the GND of R1 placed as close as possible to the GND of the device. The VOUT trace to R2 should  
be routed away from the inductor and any other traces that are switching. High AC currents flow through the VIN,  
SW, and VOUT traces, so they should be as short and wide as possible. However, making the traces wide  
increases radiated noise, so the designer must make this trade-off. Radiated noise can be decreased by  
choosing a shielded inductor. The remaining components should also be placed as close as possible to the  
device. Please see Application Note AN-1229 SIMPLE SWITCHER® PCB Layout Guidelines (SNVA054) for  
further considerations, and the LM26420 demo board as an example of a four-layer layout.  
Figure 54. Internal Connection  
For certain high power applications, the PCB land may be modified to a dog bone shape (see Figure 55). By  
increasing the size of ground plane, and adding thermal vias, the RθJA for the application can be reduced.  
Copyright © 2009–2015, Texas Instruments Incorporated  
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Product Folder Links: LM26420 LM26420-Q0 LM26420-Q1  
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