LM2587
SNVS115D –APRIL 2000–REVISED APRIL 2013
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All Output Voltage Versions Electrical Characteristics(1) (continued)
Specifications with standard type face are for TJ = 25°C, and those in bold type face apply over full Operating Temperature
Range. Unless otherwise specified, VIN = 5V.
Symbol
ISS
Parameters
Conditions
Typical
Min
Max
Units
Soft Start Current
VFEEDBACK = 0.92V
VCOMP = 1.0V
11.0
8.0/7.0
17.0/19.0
μA
D
Maximum Duty Cycle
RLOAD = 100Ω
98
15
93/90
65
%
μA
V
See(3)
IL
Switch Leakage
Current
Switch Off
VSWITCH = 60V
300/600
VSUS
VSAT
ICL
Switch Sustaining
Voltage
dV/dT = 1.5V/ns
ISWITCH = 5.0A
Switch Saturation
Voltage
0.7
6.5
1.1/1.4
V
NPN Switch
Current Limit
5.0
9.5
A
COMMON DEVICE PARAMETERS(5)
θJA
θJA
θJC
θJA
θJA
θJA
θJC
Thermal Resistance
NDH Package, Junction to Ambient(6)
NDH Package, Junction to Ambient(7)
NDH Package, Junction to Case
KTT Package, Junction to Ambient(8)
KTT Package, Junction to Ambient(9)
KTT Package, Junction to Ambient(10)
KTT Package, Junction to Case
65
45
2
°C/W
56
35
26
2
(5) External components such as the diode, inductor, input and output capacitors can affect switching regulator performance. When the
LM2587 is used as shown in Figure 7 and Figure 8, system performance will be as specified by the system parameters.
(6) Junction to ambient thermal resistance (no external heat sink) for the 5 lead TO-220 package mounted vertically, with ½ inch leads in a
socket, or on a PC board with minimum copper area.
(7) Junction to ambient thermal resistance (no external heat sink) for the 5 lead TO-220 package mounted vertically, with ½ inch leads
soldered to a PC board containing approximately 4 square inches of (1oz.) copper area surrounding the leads.
(8) Junction to ambient thermal resistance for the 5 lead TO-263 mounted horizontally against a PC board area of 0.136 square inches (the
same size as the TO-263 package) of 1 oz. (0.0014 in. thick) copper.
(9) Junction to ambient thermal resistance for the 5 lead TO-263 mounted horizontally against a PC board area of 0.4896 square inches
(3.6 times the area of the TO-263 package) of 1 oz. (0.0014 in. thick) copper.
(10) Junction to ambient thermal resistance for the 5 lead TO-263 mounted horizontally against a PC board copper area of 1.0064 square
inches (7.4 times the area of the TO-263 package) of 1 oz. (0.0014 in. thick) copper. Additional copper area will reduce thermal
resistance further. See the thermal model in Switchers Made Simple® software.
8
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