DRV8874
www.ti.com
SLVSF66A –AUGUST 2019–REVISED DECEMBER 2019
100
70
50
30
20
10
7
5
2 cm^2, 4-layer
4 cm^2, 4-layer
8 cm^2, 4-layer
16 cm^2, 4-layer
2 cm^2, 2-layer
4 cm^2, 2-layer
8cm^2, 2-layer
16cm^2, 2-layer
3
2
1
0.7
0.5
0.3
0.2
0.001 0.002 0.005 0.01 0.02
0.05 0.1
0.2 0.3 0.50.7 1 2
Pulse Duration (s)
3
4 5 67810
20 30 50 70100 200300 500 1000
1oz_
Figure 25. HTSSOP package junction-to-ambient thermal impedance for 1-oz copper layouts
100
70
50
30
20
10
7
5
2 cm^2, 4-layer
4 cm^2, 4-layer
8 cm^2, 4-layer
16 cm^2, 4-layer
2 cm^2, 2-layer
4 cm^2, 2-layer
8cm^2, 2-layer
16cm^2, 2-layer
3
2
1
0.7
0.5
0.3
0.2
0.001 0.002 0.005 0.01 0.02
0.05 0.1
0.2 0.3 0.50.7 1 2
Pulse Duration (s)
3
4 5 67810
20 30 50 70100 200300 500 1000
2oz_
Figure 26. HTSSOP package Junction-to-ambient thermal impedance for 2-oz copper layouts
Copyright © 2019, Texas Instruments Incorporated
Submit Documentation Feedback
25
TI [ TEXAS INSTRUMENTS ]
