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DRV8874PWPR 参数 Datasheet PDF下载

DRV8874PWPR图片预览
型号: DRV8874PWPR
PDF下载: 下载PDF文件 查看货源
内容描述: [40-V, 6-A H-bridge motor driver with integrated current sensing feedback | PWP | 16 | -40 to 125]
分类和应用:
文件页数/大小: 42 页 / 2946 K
品牌: TI [ TEXAS INSTRUMENTS ]
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DRV8874  
SLVSF66A AUGUST 2019REVISED DECEMBER 2019  
www.ti.com  
11  
10.5  
10  
40  
38  
36  
34  
32  
30  
28  
26  
24  
4L 1oz  
4L 2oz  
4L 1oz  
4L 2oz  
9.5  
9
8.5  
8
7.5  
7
6.5  
0
2
4
6
8
10  
12  
14  
16  
0
2
4
6
8
10  
12  
14  
16  
Top layer copper area (cm2)  
Top layer copper area (cm2)  
4L_R  
4L_P  
Figure 21. HTSSOP, 4-layer PCB junction-to-ambient  
thermal resistance vs copper area  
Figure 22. HTSSOP, 4-layer PCB junction-to-board  
characterization parameter vs copper area  
30  
27.5  
25  
160  
2L 1oz  
2L 2oz  
2L 1oz  
2L 2oz  
140  
120  
100  
80  
22.5  
20  
17.5  
15  
12.5  
10  
60  
40  
7.5  
5
20  
0
2
4
6
8
10  
12  
14  
16  
0
2
4
6
8
10  
12  
14  
16  
Top layer copper area (cm2)  
Top layer copper area (cm2)  
2L_R  
2L_P  
Figure 23. HTSSOP, 2-layer PCB junction-to-ambient  
thermal resistance vs copper area  
Figure 24. HTSSOP, 2-layer PCB junction-to-board  
characterization parameter vs copper area  
8.2.1.2.3.2 Transient Thermal Performance  
The motor driver may experience different transient driving conditions that cause large currents to flow for a short  
duration of time. These may include  
Motor start-up when the rotor is not yet spinning at full speed.  
Fault conditions when there is a supply or ground short to one of the motor outputs, and the device goes into  
and out of overcurrent protection.  
Briefly energizing a motor or solenoid for a limited time, then de-energizing.  
For these transient cases, the duration of drive time is another factor that impacts thermal performance. In  
transient cases, the thermal impedance parameter ZθJA denotes the junction-to-ambient thermal performance.  
Figure 25 and Figure 26 show the simulated thermal impedances for 1-oz and 2-oz copper layouts for the  
HTSSOP package. These graphs indicate better thermal performance with short current pulses. For short  
periods of drive time, the device die size and package dominates the thermal performance. For longer drive  
pulses, board layout has a more significant impact on thermal performance. Both graphs show the curves for  
thermal impedance split due to number of layers and copper area as the duration of the drive pulse duration  
increases. Long pulses can be considered steady-state performance.  
24  
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