DAC1220
SBAS082G – FEBRUARY 1998 – REVISED SEPTEMBER 2009......................................................................................................................................
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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
For the most current package and ordering information see the Package Option Addendum at the end of this
document, or see the TI web site at
www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range (unless otherwise noted).
DAC1220
AV
DD
to DV
DD
AV
DD
to AGND
DV
DD
to DGND
AGND to DGND
V
REF
voltage to AGND
Digital input voltage to DGND
Digital output voltage to DGND
Package power dissipation
Maximum junction temperature (T
J
max)
Thermal resistance,
θ
JA
Lead temperature (soldering, 10s)
(1)
SSOP-16
±0.3
–0.3 to +6
–0.3 to +6
±0.3
+2.0 to +3.0
–0.3 to DV
DD
+ 0.3
–0.3 to DV
DD
+ 0.3
(T
J
max – T
A
) /
θ
JA
+150
200
+300
UNIT
V
V
V
V
V
V
V
W
°C
°C/W
°C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under the Electrical Characteristics
is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
2
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