bq51010
bq51011
bq51013
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SLVSAT9B –APRIL 2011–REVISED AUGUST 2011
THERMAL INFORMATION
RHL
20 PiNS
37.7
YFF
28 PINS
58.9
0.2
THERMAL METRIC(1)
UNITS
θJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
θJCtop
θJB
35.5
13.6
9.1
°C/W
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
0.5
1.4
ψJB
13.5
8.9
θJCbot
2.7
n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
Input voltage range, VIN
PINS
RECT
RECT
OUT
MIN
MAX
10
UNITS
V
4
Input current, IIN
1.5
1.5
1
A
Output current, IOUT
Sink current, IAD-EN
A
AD-EN
COMM
mA
mA
ºC
COMM sink current, ICOMM
Junction Temperature, TJ
500
125
0
TYPICAL APPLICATION SCHEMATICS
bq5101x
System
Load
AD-EN
AD
OUT
CCOMM1
C4
COMM1
BOOT1
AC1
CBOOT1
D1
RECT
VTSB
C1
R4
C3
R2
COIL
C2
TS/CTRL
AC2
R3
NTC
BOOT2
COMM2
CBOOT2
HOST
CHG
3-State
CCOMM2
CCLAMP2
CCLAMP1
CLAMP2
CLAMP1
ILIM
EN1
EN2
Bi-State
Bi-State
PGND
R1
Figure 2. bq5101x Used as a Wireless Power Receiver and Power Supply for System Loads
Copyright © 2011, Texas Instruments Incorporated
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