bq24030, bq24031, bq24032,
bq24032A, bq24035, bq24038, bq24039
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SLUS618C–AUGUST 2004–REVISED JUNE 2005
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
bq24030, bq24031,
bq24032, bq24032A,
bq24035, bq24038. bq24039
AC (DC voltage wrt (with respect to) VSS)
–0.3 V to 18 V
–0.3 V to 7 V
Input voltage
USB (DC voltage wrt VSS)
BAT, CE, DPPM, ACPG, PSEL, OUT, ISET1, ISET2, ISET3,
STAT1, STAT2, TS, USBPG , PG, VBSEL (all DC voltages wrt
–0.3 V to 7 V
VSS)
Input voltage
LDO (DC voltage wrt VSS)
–0.3 V to VO(OUT) + 0.3 V
–0.3 V to VO(LDO) + 0.3 V
3.5 A
TMR
AC
Input current
USB
OUT
BAT(2)
1000 mA
4 A
Output current
–4 A to 3.5 A
Output source current (in
regulation at 3.3 V LDO)
LDO
30 mA
Output sink current
ACPG, STAT1, STAT2, USBPG, PG
1.5 mA
–65°C to 150°C
–40°C to 150°C
300°C
Storage temperature range, Tstg
Junction temperature range, TJ
Lead temperature (soldering, 10 seconds)
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage
values are with respect to the network ground terminal unless otherwise noted.
(2) Negative current is defined as current flowing into the BAT pin.
RECOMMENDED OPERATING CONDITIONS
MIN
4.35
4.55
4.35
MAX UNIT
bq24030/2/2A/5/9, bq24038 (at VBSEL = LOW)
bq24031, bq24038 (at VBSEL = HIGH)
16.00
Supply voltage (from AC input)
VCC
(1)(2)
16
6.0
2
V
(1)
VCC Supply voltage (from USB input)
IAC Input current, AC
IUSB Input current, USB
TJ Operating junction temperature range
A
0.5
125
–40
°C
(1) VCC is defined as the greater of AC or USB input.
(2) Verify that power dissipation and junction temperatures are within limits at maximum VCC
.
DISSIPATION RATINGS
T
A ≤ 40°C
DERATING FACTOR
PACKAGE
θJA
46.87 °C/W
POWER RATING
TA > 40°C
20-pin RHL(1)
1.81 W
21 mW/°C
(1) This data is based on using the JEDEC High-K board and the exposed die pad is connected to a Cu pad on the board. This is
connected to the ground plane by a 2×3 via matrix.
3
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