ADS131B04-Q1
ZHCSMK3B –NOVEMBER 2020 –REVISED NOVEMBER 2021
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6.3 Recommended Operating Conditions
over operating ambient temperature range (unless otherwise noted)
MIN
NOM
MAX UNIT
POWER SUPPLY
AVDD to AGND
Analog power supply
2.7
–0.3
2.7
3.3
0
3.6
V
AGND to DGND
0.3
Digital power supply
DVDD to DGND
3.3
3.6
V
ANALOG INPUTS(1)
AGND –
Gain = 1, 2
AVDD –1.2
AVDD –2.4
VREF / Gain
0.1
VAINxP
VAINxN
,
Absolute input voltage
V
V
AGND –
Gain = 4, 8, 16, 32, 64, 128
VIN = VAINxP - VAINxN
0.3
–VREF
/
VIN
Differential input voltage
Gain
EXTERNAL CLOCK SOURCE(2)
High-resolution mode
Low-power mode
0.3
0.3
8.192
4.096
2.048
50%
8.2
fCLKIN
External clock frequency
4.15 MHz
2.08
Very-low-power mode
0.3
Duty cycle
40%
60%
DIGITAL INPUTS
Input voltage
TEMPERATURE
TA Operating ambient temperature
DGND
DVDD
V
125
°C
–40
(1) The subscript "x" signifies the channel. For example, the positive analog input of channel 0 is named AIN0P. See the Pin Configuration
and Functions section for the pin names.
(2) An external clock is not required when the internal oscillator is used.
6.4 Thermal Information
ADS131B04-Q1
THERMAL METRIC(1)
PW (TSSOP)
20 PINS
91.5
UNIT
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
Rθ
Junction-to-case (top) thermal resistance
31.4
JC(top)
RθJB
ΨJT
Junction-to-board thermal resistance
43.0
2.0
°C/W
°C/W
°C/W
Junction-to-top characterization parameter
Junction-to-board characterization parameter
42.5
ΨJB
Rθ
Junction-to-case (bottom) thermal resistance
N/A
°C/W
JC(bot)
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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