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73S8010R-IMR/F 参数 Datasheet PDF下载

73S8010R-IMR/F图片预览
型号: 73S8010R-IMR/F
PDF下载: 下载PDF文件 查看货源
内容描述: 低成本智能卡接口 [Low Cost Smart Card Interface]
分类和应用: 模拟IC信号电路
文件页数/大小: 24 页 / 343 K
品牌: TERIDIAN [ TERIDIAN SEMICONDUCTOR CORPORATION ]
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73S8010C  
Low Cost Smart Card Interface  
DATA SHEET  
TYPICAL APPLICATION SCHEMATIC  
AUX2UC_to/from_uC  
AUX1UC_to.from_uC  
I/OUC_to/from_uC  
See NOTE 5  
See note 7  
See NOTE 3  
SAD0  
SAD1  
SAD2  
External_clock_from uC  
- OR -  
C2  
VDD  
22pF  
Y1  
C3  
1
2
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
R3  
SAD0  
SAD1  
SAD2  
GND  
GND  
VPC  
NC  
AUX2UC  
AUX1UC  
I/OUC  
Rext2  
C4  
C5  
3
22pF  
CRYSTAL  
VPC  
4
XTALOUT  
XTALIN  
100nF  
10uF  
5
See NOTE 4  
6
INT  
GND  
7
VDD  
See note 2  
See NOTE 1  
8
NC  
VDD  
9
NC  
SDA  
C6  
100nF  
10  
11  
12  
13  
14  
PRES  
I/O  
SCL  
VDDF_ADJ  
VCC  
AUX2  
AUX1  
GND  
R1  
RST  
Rext1  
R4  
2K  
R5  
2K  
CLK  
See note 6  
73S8010R  
SO28  
INT_interrupt_to_uC  
SDA_to/from_uC  
SCK_from_uC  
VDD  
R2  
NOTES:  
1) VDD = 2.7V to 5.5V DC.  
2) VPC = 4.75V(EMV, ISO) to 5.5V DC  
ISO7816=1uF, EMV=3.3uF  
Low ESR (<100mohms) C1  
should be placed near the SC  
connecter contact  
Card detection  
switch is  
20K  
C1  
normally closed  
3) Required if external clock from uP is used.  
4) Required if crystal is used.  
CLK track should be routed  
far from RST, I/O, C4 and  
C8.  
Y1, C2 and C3 must be removed if external clock is used.  
5) Optional. Can be left open.  
6) R1 and R3 are external resistors that adjust the VDD  
Smart Card Connector  
fault voltage. Can be left open.  
7) Hardware to define address of device  
Figure 10: 73S8010R – Typical Application Schematic  
Page: 15 of 24  
© 2005-2008 TERIDIAN Semiconductor Corporation  
Rev 1.5