TSL2562, TSL2563
LOW-VOLTAGE
LIGHT-TO-DIGITAL CONVERTER
TAOS066J − MAY 2007
MANUFACTURING INFORMATION
Tooling Required
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Chipscale
− Solder stencil (square aperture size 0.210 mm, stencil thickness of 152 μm)
TMB
− Solder stencil (aperture size 0.70 mm x 0.90 mm, stencil thickness of 152 μm)
Process
1. Apply solder paste using stencil
2. Place component
3. Reflow solder/cure
4. X-Ray verify (recommended for chipscale only)
Additional Notes for Chipscale
Placement of the TSL2562/TSL2563 chipscale device onto the gold immersion substrate is accomplished using
a standard surface mount manufacturing process. Using a 152-μm stencil with a 0.21 mm square aperture, print
solder paste onto the substrate. Machine-place the TSL2562/TSL2563 from the tape onto the substrate. A
suggest pick-up tool is the Siemens Vacuum Pickup tool nozzle number 912. This nozzle has a rubber tip with
a diameter of approximately 0.75 mm. The part is picked up from the center of the body.
It is important to use a substrate that has an immersion plating surface. This may be immersion gold, solder,
or white tin. Hot air solder leveled (HASL) substrates are not coplanar, making them difficult to work with.
Qualified Equipment
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EKRA E5 — Stencil Printer
ASYMTEC Century — Dispensing system
SIEMENS F5 — Placement system
− SIEMENS 912 — Vacuum Pickup Tool Nozzle
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VITRONICS 820 — Oven
PHOENIX — Inspector X-Ray system
Qualified Materials
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Microbond solder paste, part number NC421
Copyright E 2007, TAOS Inc.
The LUMENOLOGY r Company
r
r
www.taosinc.com
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TAOS [ TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS ]
