TSL2562, TSL2563
LOW-VOLTAGE
LIGHT-TO-DIGITAL CONVERTER
TAOS066J − MAY 2007
MANUFACTURING INFORMATION
The CS and T packages have been tested and have demonstrated an ability to be reflow soldered to a PCB
substrate. The process, equipment, and materials used in these test are detailed below.
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The components should
be limited to a maximum of three passes through this solder reflow profile.
Table 13. TSL2562/63 Solder Reflow Profile
PARAMETER
Average temperature gradient in preheating
Soak time
REFERENCE
TSL2562/63
2.5°C/sec
t
2 to 3 minutes
Max 60 sec
soak
Time above 217°C
t
t
t
1
2
3
Time above 230°C
Max 50 sec
Time above T
−10°C
Max 10 sec
peak
Peak temperature in reflow
T
260° C (−0°C/+5°C)
Max −5°C/sec
peak
Temperature gradient in cooling
Not to scale — for reference only
T
peak
T
3
T
T
2
1
Time (sec)
t
t
t
3
2
1
t
soak
Figure 23. TSL2562/TSL2563 Solder Reflow Profile Graph
Copyright E 2007, TAOS Inc.
The LUMENOLOGY r Company
r
r
34
www.taosinc.com
TAOS [ TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS ]
