TSL2562, TSL2563
LOW-VOLTAGE
LIGHT-TO-DIGITAL CONVERTER
TAOS066J − MAY 2007
MECHANICAL DATA
PACKAGE TMB-6
TOP VIEW
Six-Lead Surface Mount Device
TOP VIEW
1.90
0.31
PIN 1
R 0.20
6 Pls
2.60
PIN 4
3.80
Photo-Active Area
0.88
END VIEW
1.35
0.50
BOTTOM VIEW
0.90
TYP
0.90 TYP
0.60
TYP
0.30
TYP
Pb
Lead Free
0.30
TYP
NOTES: A. All linear dimensions are in millimeters. Dimension tolerance is ± 0.20 mm unless otherwise noted.
B. The photo-active area is 1398 μm by 203 μm.
C. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
D. Contact finish is 0.5 μm minimum of soft gold plated over a 18 μm thick copper foil pattern with a 5 μm to 9 μm nickel barrier.
E. The underside of the package includes copper traces used to connect the pads during package substrate fabrication. Accordingly,
exposed traces and vias should not be placed under the footprint of the TMB package in a PCB layout.
F. This package contains no lead (Pb).
G. This drawing is subject to change without notice.
Figure 20. Package T — Six-Lead TMB Plastic Surface Mount Packaging Configuration
Copyright E 2007, TAOS Inc.
The LUMENOLOGY r Company
r
r
www.taosinc.com
31
TAOS [ TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS ]
