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JMR042ABJ0R5ZD-T 参数 Datasheet PDF下载

JMR042ABJ0R5ZD-T图片预览
型号: JMR042ABJ0R5ZD-T
PDF下载: 下载PDF文件 查看货源
内容描述: 有关本公司产品的注意事项 [Notice for TAIYO YUDEN products]
分类和应用:
文件页数/大小: 27 页 / 2134 K
品牌: TAIYO YUDEN [ TAIYO YUDEN (U.S.A.), INC ]
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(2)Examples of good and bad solder application  
Items  
Not eommended  
Recommended  
Mixed mounting of SMD and  
leaded components  
Component placement close to  
the chassis  
Hand-soldering of leaded  
Components near mounted  
components  
Horizontal component  
placement  
◆Pattern configurations (Capacitor layout on PCBs)  
1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any  
stresses from board warp or deflection.  
possible mechanical  
Items  
Not recommended  
Recommended  
Place the product at a right  
angle to the direction of the  
anticipated mechanical  
stress.  
Deflection of board  
1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.  
1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods  
are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB,  
split methods as well as chip location.  
3. Mounting  
Precautions  
◆Adjustment of mounting machine  
1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.  
2. Maintenance and inspection of mounting machines shall be conducted periodically.  
◆Selection of Adhesives  
1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the  
following factors are appropriately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and  
hardening period. Therefore, please contact us for further information.  
◆Adjustment of mounting machine  
1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid  
this, the following points shall be considerable.  
Technical  
(1)The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection.  
(2)The pressure of nozzle shall be adjusted between 1 and 3 N static loads.  
considerations  
(3)To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be  
used on the other side of the PCB. The following diagrams show some typical examples of good and bad pick-up nozzle  
placement:  
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.  
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .  
c_mlcc_prec_e-01  
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