欢迎访问ic37.com |
会员登录 免费注册
发布采购

BK0603HM600 参数 Datasheet PDF下载

BK0603HM600图片预览
型号: BK0603HM600
PDF下载: 下载PDF文件 查看货源
内容描述: 多层片状磁珠电感器( BK系列) [MULTILAYER CHIP BEAD INDUCTORS (BK SERIES)]
分类和应用: 电感器
文件页数/大小: 27 页 / 1712 K
品牌: TAIYO YUDEN [ TAIYO YUDEN (U.S.A.), INC ]
 浏览型号BK0603HM600的Datasheet PDF文件第19页浏览型号BK0603HM600的Datasheet PDF文件第20页浏览型号BK0603HM600的Datasheet PDF文件第21页浏览型号BK0603HM600的Datasheet PDF文件第22页浏览型号BK0603HM600的Datasheet PDF文件第23页浏览型号BK0603HM600的Datasheet PDF文件第24页浏览型号BK0603HM600的Datasheet PDF文件第25页浏览型号BK0603HM600的Datasheet PDF文件第27页  
PRECAUTIONS  
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer chip bead Inductors  
4. Soldering  
Selection of Flux  
1. Since flux may have a significant effect on the performance of inductors, it is necessary to verify the following conditions prior to use;  
1Flux used should be with less than or equal to 0.1 wt%Chlorine conversion methodof halogenated content. Flux having a strong acidity content should  
not be applied.  
Precautions  
2When soldering inductors on the board, the amount of flux applied should be controlled at the optimum level.  
3When using water-soluble flux, special care should be taken to properly clean the boards.  
Soldering  
1. Temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions, and please contact us about peak tem-  
perature when you use lead-free paste.  
Selection of Flux  
1-1. When too much halogenated substanceChlorine, etc.content is used to activate the flux, or highly acidic flux is used, an excessive amount of residue  
after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the surface of the Inductor.  
1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a large amount of flux gas may be emitted and may detrimentally affect  
solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.  
1-3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of Inductor in high humidity conditions may  
cause a degradation of insulation resistance and therefore affect the reliability of the components. The cleaning methods and the capability of the machines  
used should also be considered carefully when selecting water-soluble flux.  
Soldering  
1-1. Preheating when soldering  
Heating: Chip inductor components should be preheated to within 100 to 130of the soldering. Cooling: The temperature difference between the  
components and cleaning process should not be greater than 100.  
Chip inductors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the soldering process must be  
conducted with a great care so as to prevent malfunction of the components due to excessive thermal shock.  
Recommended conditions for soldering  
Reflow soldering]  
Temperature profile  
Temperature(℃)  
Pb free soldering)  
300  
Peak 260max  
10 sec max  
200  
100  
0
Gradually  
cooling  
Preheating  
150℃  
60 sec min  
Heating above 230℃  
40 sec max  
Ceramic chip components should be preheated to  
within 100 to 130of the soldering.  
Assured to be reflow soldering for 2 times.  
Caution  
1. The ideal condition is to have solder mass filletcontrolled to 1/2 to 1/3 of the thickness of the inductor, as shown below:  
2. Because excessive dwell times can detrimentally affect solderability, soldering duration should be kept as close to recommended times as possible.  
Technical  
consider-  
ations  
Wave soldering]  
Temperature profile  
Temperature(℃)  
Pb free soldering)  
300  
Peak 260max  
10 sec max  
200  
100  
0
Gradually  
cooling  
Preheating  
150℃  
120 sec min  
Ceramic chip components should be preheated to  
within 100 to 130of the soldering.  
Assured to be wave soldering for 1 time.  
Except for reflow soldering type.  
Caution  
1. Make sure the inductors are preheated sufficiently.  
2. The temperature difference between the inductor and melted solder should not be greater than 100 to 130.  
3. Cooling after soldering should be as gradual as possible.  
4. Wave soldering must not be applied to the inductors designated as for reflow soldering only.  
Hand soldering]  
Temperature profile  
Temperature(℃)  
Pb free soldering)  
400  
350max  
3 sec max  
300  
200  
Gradually  
cooling  
⊿T  
100  
0
60 sec min  
(※T1903216Type max, T≦ 1303225  
Type ming)  
It is recommended to use 20W soldering iron and  
the tip is 1φor less.  
The soldering iron should not directly touch the  
components.  
Assured to be soldering iron for 1 time.  
Note: The above profiles are the maximum allowable  
soldering condition, therefore these profiles are  
not always recommended.  
Caution  
1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm.  
2. The soldering iron should not directly touch the inductor.  
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.  
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.  
mlci0109_reli_e-01  
mlci0109_reli-PRP15  
 复制成功!