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BK0603HM600 参数 Datasheet PDF下载

BK0603HM600图片预览
型号: BK0603HM600
PDF下载: 下载PDF文件 查看货源
内容描述: 多层片状磁珠电感器( BK系列) [MULTILAYER CHIP BEAD INDUCTORS (BK SERIES)]
分类和应用: 电感器
文件页数/大小: 27 页 / 1712 K
品牌: TAIYO YUDEN [ TAIYO YUDEN (U.S.A.), INC ]
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PRECAUTIONS  
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer chip bead Inductors  
2. PCB Design  
Pattern configurations Inductor layout on panelizedbreakawayPC boards)  
1-1. The following are examples of good and bad inductor layout; SMD inductors should be located to minimize any possible mechanical stresses from board  
warp or deflection.  
Item  
Not recommended  
Recommended  
Deflection of the board  
1-2. To layout the inductors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary depending on inductor layout.  
An example below should be counted for better design.  
Technical  
consider-  
ations  
1-3. When breaking PC boards along their perforations, the amount of mechanical stress on the inductors can vary according to the method used. The following  
methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, any ideal SMD inductor layout must  
also consider the PCB splitting procedure.  
3. Considerations for automatic placement  
Adjustment of mounting machine  
1. Excessive impact load should not be imposed on the inductors when mounting onto the PC boards.  
2. The maintenance and inspection of the mounter should be conducted periodically.  
Precautions Selection of Adhesives  
1. Mounting inductors with adhesives in preliminary assembly, before the soldering stage, may lead to degraded inductor characteristics unless the following  
factors are appropriately checked; the size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, it is  
imperative to consult the manufacturer of the adhesives on proper usage and amounts of adhesive to use.  
Adjustment of mounting machine  
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the inductors, causing damage. To avoid this, the following points should be  
considered before lowering the pick-up nozzle:  
1The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC board after correcting for deflection of the board.  
2The pick-up pressure should be adjusted between 1 and 3N static loads.  
3To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins should be used under the PC  
board. The following diagrams show some typical examples of good pick-up nozzle placement:  
Item  
Improper method  
Proper method  
Single-sided mounting  
Double-sided mounting  
2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the inductors because of mechanical impact on the  
inductors. To avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance, inspection and replacement of the  
pin should be conducted periodically.  
Technical  
consider-  
ations  
Selection of Adhesives  
1. Some adhesives may cause reduced insulation resistance. The difference between the shrinkage percentage of the adhesive and that of the inductors may  
result in stresses on the inductors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect component  
placement, so the following precautions should be noted in the application of adhesives.  
1Required adhesive characteristics  
a. The adhesive should be strong enough to hold parts on the board during the mounting & solder process.  
b. The adhesive should have sufficient strength at high temperatures.  
c. The adhesive should have good coating and thickness consistency.  
d. The adhesive should be used during its prescribed shelf life.  
e. The adhesive should harden rapidly.  
f. The adhesive must not be contaminated.  
g. The adhesive should have excellent insulation characteristics.  
h. The adhesive should not be toxic and have no emission of toxic gasses.  
2When using adhesives to mount inductors on a PCB, inappropriate amounts of adhesive on the board may adversely affect component placement. Too  
little adhesive may cause the inductors to fall off the board during the solder process. Too much adhesive may cause defective soldering due excessive  
flow of adhesive on to the land or solder pad.  
Recommended conditions]  
Figure  
0805 case sizes as examples  
0.3mm min  
a
b
c
100120μm  
Area with no adhesive  
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.  
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.  
mlci0109_reli_e-01  
mlci0109_reli-PRP14  
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