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BK0603HM600 参数 Datasheet PDF下载

BK0603HM600图片预览
型号: BK0603HM600
PDF下载: 下载PDF文件 查看货源
内容描述: 多层片状磁珠电感器( BK系列) [MULTILAYER CHIP BEAD INDUCTORS (BK SERIES)]
分类和应用: 电感器
文件页数/大小: 27 页 / 1712 K
品牌: TAIYO YUDEN [ TAIYO YUDEN (U.S.A.), INC ]
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PRECAUTIONS  
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer chip bead Inductors  
1. Circuit Design  
Verification of operating environment, electrical rating and performance  
1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social ramifications.  
As such, any inductors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly differentiated from  
Precautions  
components used in general purpose applications.  
Operating CurrentVerification of Rated current)  
1. The operating current for inductors must always be lower than their rated values.  
2. Do not apply current in excess of the rated value because the inductance may be reduced due to the magnetic saturation effect.  
2. PCB Design  
Pattern configurations Design of Land-patterns)  
1. When inductors are mounted on a PCB, the size of land patterns and the amount of solder usedsize of filletcan directly affect inductor performance.  
Therefore, the following items must be carefully considered in the design of solder land patterns:  
1The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking. Therefore, when  
designing land-patterns it is necessary to consider the appropriate size and configuration of the solder pads which in turn determines the amount of  
solder necessary to form the fillets.  
2When more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's soldering point is separated  
Precautions  
by solder-resist.  
3The larger size of land patterns and amount of solder, the smaller Q value after mounting on PCB. It makes higher the Q value to design land patterns  
smaller than terminal electrode of chips.  
Pattern configurations Inductor layout on panelizedbreakawayPC boards)  
1. After inductors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing processesPCB cutting,  
board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered boards etc.For this reason, planning pattern  
configurations and the position of SMD inductors should be carefully performed to minimize stress.  
Pattern configurations Design of Land-patterns)  
1. The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts larger fillets which extend above  
the component end terminations. Examples of improper pattern designs are also shown.  
1Recommended land dimensions for a typical chip inductor land patterns for PCBs  
Recommended land dimensions for wave-soldering  
Recommended land dimensions for reflow-soldering  
Type  
L
1608  
1.6  
2125  
2.0  
3216  
3.2  
Type  
L
0402  
0.4  
0603  
0.6  
1005  
1.0  
105  
1.0  
0.6  
1608  
1.6  
2012  
2.0  
2125  
2.0  
2016  
2.0  
3216  
3.2  
2520  
2.5  
W
A
0.8  
1.25  
1.6  
W
A
0.2  
0.3  
0.5  
0.8  
1.25  
1.25  
1.6  
1.6  
2.0  
0.81.0 1.01.4 1.82.5  
0.50.8 0.81.5 0.81.7  
0.60.8 0.91.2 1.21.6  
Unitmm)  
0.150.25 0.200.30 0.450.55 0.500.55 0.81.0 0.81.2 0.81.2 0.81.2 1.82.5 1.01.4  
0.100.20 0.200.30 0.400.50 0.300.40 0.60.8 0.81.2 0.81.2 0.81.2 0.61.5 0.61.0  
0.150.30 0.250.40 0.450.55 0.600.70 0.60.8 0.91.6 0.91.6 1.22.0 1.22.0 1.82.2  
Unitmm)  
B
B
C
C
Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore, please take proper precautions when designing land-patterns.  
Recommended land dimension for Reflow-soldering  
Type  
L
3216  
3.2  
2010  
2.0  
W
a
1.6  
1.0  
0.70.9 0.50.6  
0.81.0 0.50.6  
0.40.5 0.20.3  
Technical  
consider-  
ations  
b
c
d
0.8  
0.5  
Unitmm)  
2Examples of good and bad solder application  
Item  
Not recommended  
Recommended  
Mixed mounting of SMD  
and leaded components  
Component placement  
close to the chassis  
Hand-soldering of leaded  
components near mounted  
components  
Horizontal component  
placement  
To next page  
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.  
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.  
mlci0109_reli_e-01  
mlci0109_reli-PRP13  
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