■ RELIABILITY DATA
Multilayer chip inductors and beads
10. Resistance to Flexure of Substrate
BK0402
BK0603
BK1005
BKH1005
BK1608
BK2125
BK2010
ARRAY
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
No mechanical damage.
NM2520
LK1005
LK1608
LK2125
HK0402
HK0603
HK1005
HK1608
HK2125
HKQ0603S
HKQ0603U
AQ105
【Test Methods and Remarks】
Warp：2mm（BK Series without 0402size, BKP, BKH, CK, CKS, CKP, NM, LK, HK, HKQ, AQ Series）
：1mm（BK0402, HK0402 Series）
Testing board：glass epoxy-resin substrate
Thickness：0.8mm
11. Solderability
BK0402
BK0603
BK1005
BKH1005
BK1608
BK2125
At least 75％ of terminal electrode is covered by new solder.
BK2010
ARRAY
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
CK1608
CK2125
CKS2125
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
At least 75％ of terminal electrode is covered by new solder.
LK2125
HK0402
HK0603
HK1005
HK1608
HK2125
HKQ0603S
HKQ0603U
AQ105
【Test Methods and Remarks】
Solder temperature：230±5℃
Duration：4±1 sec.
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlci0109_reli_e-01
mlci0109_reli-PRP8
TAIYO YUDEN [ TAIYO YUDEN (U.S.A.), INC ]
