■ PRECAUTIONS
3.Soldering
◆Selection of Flux
1.Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;
（1）Flux used should be with less than or equal to 0.1 wt%（equivelent to chroline）of halogenated content. Flux having a strong acidity content should not
be applied.
（2）When soldering capacitors on the board, the amount of flux applied should be controlled at the optimum level.
（3）
When using water-soluble flux, special care should be taken to properly clean the boards.
Precautions
◆Soldering
1.Temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions.
Sn-Zn solder paste can affect MLCC reliability performance.
Please contact us prior to usage.
◆Selection of Flux
1-1. When too much halogenated substance（Chlorine, etc.）content is used to activate the flux, or highly acidic flux is used, an excessive amount of
residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the surface of the capacitors.
1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a large amount of flux gas may be emitted and may detrimentally
affect solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of capacitors in high humidity
conditions may cause a degradation of insulation resistance and therefore affect the reliability of the components. The cleaning methods and the
capability of the machines used should also be considered carefully when selecting water-soluble flux.
◆Soldering
1-1.Preheating when soldering
Heating: Ceramic chip components should be preheated to within 100 to 130℃ of the soldering.
Cooling: The temperature difference between the components and cleaning process should not be greater than 100℃.
Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the soldering
process must be conducted with great care so as to prevent malfunction of the components due to excessive thermal shock.
【Recommended conditions for soldering】
【Recommended conditions for Pd Free soldering】
［Reflow soldering］
Temperature profile
Technical
considerations
Temperature（℃）
（Pb free soldering）
300
Peak 260℃ max
10 sec max
200
100
0
Gradually
cooling
Preheating
150℃
60 sec min
Heating above 230℃
40 sec max
※Ceramic chip components should be preheated to
within 100 to 130℃ of the soldering.
※Assured to be reflow soldering for 2 times.
Caution
①The ideal condition is to have solder mass（fillet）controlled to 1/2 to 1/3 of the thickness of the capacitor, as shown below:
Capacitor
Solder
PC board
②Because excessive dwell times can detrimentally affect solderability, soldering duration should be kept as close to recommended times as
possible.
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc09_prec_e-01
mlcc09_prec-P2
TAIYO YUDEN [ TAIYO YUDEN (U.S.A.), INC ]
