■ RELIABILITY DATA
14. Resistance to Soldering Heat
Appearance：No abnormality
Capacitance Change：≤±7.5%
Specified Value
Q or Dissipation Factor：[Dissipation Factor]Initial value shall be satisfied.
Insulation Resistance：Initial value shall be satisfied.
Dielectric Withstanding Voltage（between terminals）：No abnormality
【Test Methods and Remarks】
Heat treatment specified in No.5 of the specification shall be conducted prior to test.
Immerse test sample in an solder solution（Sn/3.0Ag/0.5Cu）.
Soldering temperature : 270℃±5℃
Duration: 3±0.5 seconds
Soaking position : test sample is soaked until the terminal electrode is covered in solder solution.Preheating condition：3216 size or smaller size：120～150℃ for 1 minute,
3225 size：100～120℃ for 1 minute, 170～200℃ for 1 minute. Measurement after the test shall be made after test sample is kept at room temperature for 24 ±2 hours.
15. Solderability
Specified Value
More than 95% of terminal electrode shall be covered with fresh solder.
【Test Methods and Remarks】
Heat treatment specified in No.5 of the specification shall be conducted prior to test.
Immerse test sample in an solder solution（Sn/3.0Ag/0.5Cu）. Soldering temperature : 245℃±5℃
Duration: 4±1 seconds
Dipping position : test sample is immersed until the terminal electrode is covered in solder solution.
16. Thermal shock
Appearance：No abnormality
Capacitance Change：≤ ±7.5%
Specified Value
Q or Dissipation Factor：Dissipation Factor]Initial value shall be satisfied.
Insulation Resistance：Initial value shall be satisfied.
Dielectric Withstanding Voltage（between terminals）：No abnormality
【Test Methods and Remarks】
Heat treatment specified in No.5 of the specification shall be conducted prior to test.
Measurement shall be conducted after test sample is heat treated as specified in No.5.
condition of the one cycle（Air－Air）/
stage 1 temperature：minimum usage temperature（－3℃/＋0）for 15±1 min. transfer time within 20 seconds
stage 2 temperature：maximum usage temperature（－0℃/＋3℃）for 15±1 min. transfer time within 20 seconds test cycles：100 times.
Measurement after the test shall be made after test sample is kept at room temperature for 24 ±2 hours.
c
Case size
Dimension
1608
0.6
2125
0.8
3216
2.0
3225
2.0
a
b
c
b
2.2
3.0
4.4
4.4
a
0.9
1.3
1.7
2.6
Fig.2
17. Humidity Loading
Specified Value
Appearance：No abnormality
Capacitance Change：≤ ±12.5%
Q or Dissipation Factor：5.0max.
Insulation Resistance：Larger than Whichever smaller of 25MΩ・µF or 500MΩ
【Test Methods and Remarks】
Test condition: 85℃/85%RH.
Duration : 1000 ＋48/－0 hours.
DC Bias : Applied Rated Voltage.
Voltage treatment specified in No.6 of the specification shall be conducted prior to test. Measurement after the test shall be made after test sample is kept at room tempera-
ture for 24 ±2 hours.
18. High Temperature Loading
Appearance：No abnormality
Capacitance Change：≤ ±12.5%
Specified Value
Q or Dissipation Factor：5.0max.
Insulation Resistance：Larger than Whichever smaller of 25MΩ・µF or 500MΩ
【Test Methods and Remarks】
Voltage treatment specified in No.6 of the specification shall be conducted prior to test. Test sample shall be put in thermostatic oven with maximum temperature.
Applied voltage : Rated voltage x 2
Duration : 1000 ＋48/－0 hours.
Charging and discharging current shall be 50mA or less. Measurement after the test shall be made after test sample is kept at room temperature for 24 ±2 hours.
19. Resistance to Flexure of substrate
Appearance：No abnormality
Capacitance Change：≤ ±12.5%
Specified Value
Q or Dissipation Factor：[Dissipation Factor]Initial value shall be satisfied.
Insulation Resistance：Initial value shall be satisfied.
【Test Methods and Remarks】
Warp : 1 mm Testing board: grass epoxy－ resin substrate thickness :
1.6 ｍｍTest board and solderlands refer to fig. 3 Measurement shall be made with board in the bent position（. fig.4）
Case size
R5
Dimension
1608
0.6
2125
0.8
3216
2.0
3225
2.0
Board
Warp
a
b
c
2.2
3.0
4.4
4.4
45±2 45±2
0.9
1.3
1.7
2.6
Fig.3
20. High Temperature Exposure
ꢀFig.4
Appearance：No abnormality
Capacitance Change：≤ ±10.0%
Q or Dissipation factor : 5.0max.
Specified Value
Insulation Resistance：Larger than whichever smaller of 500MΩ・µF or 10000MΩ
【Test Methods and Remarks】
Heat treatment specified in No.5 of the specification shall be conducted prior to test. Test sample shall be put in thermostatic oven with maximum temperature.
Duration : 1000 ＋48/－0 hours.
Initial value shall be measured after test sample is heat－treated specified No.5.
Measurement after the test shall be made after test sample is kept at room temperature for 24 ±2 hours.
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc09_reli_e-01
mlcc09_reli-P2
TAIYO YUDEN [ TAIYO YUDEN (U.S.A.), INC ]
